Effect of impurity distribution on corrosion behavior of electrodeposited copper in H2 O2 -based slurry

Journal of the Electrochemical Society

Volumn 154, Issue 6, 2007, Pages

  Lin, Jeng Yu ^a,b   Wan, Chi Chao ^a,c   Wang, Yung Yun ^a   Chen, Jui Chin ^b   Lai, Jiun Yu ^b   Fan, Yuh Da ^b   Chuang, Jui Ping ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

^c ELECTROCHEMICAL SOCIETY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CORROSION BEHAVIOR; IMPURITY DISTRIBUTIONS;

CHEMICAL MECHANICAL POLISHING; COPPER; CORROSION; ELECTRODEPOSITION; HYDROGEN PEROXIDE; SLURRIES; X RAY ANALYSIS;

IMPURITIES;

EID: 34547177939     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2722562     Document Type: Article

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