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Materials Science and Engineering: A

Volumn 382, Issue 1-2, 2004, Pages 104-111

The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thiourea

(4) Kao, Y L a Tu, G C a Huang, C A b Chang, J H b

a NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

b CHANG GUNG UNIVERSITY (Taiwan)

Author keywords

Annealing; Copper deposit; Softening resistance; Sulfur rich particle deposit; Thiourea

Indexed keywords

ANNEALING; CONCENTRATION (PROCESS); COPPER; DEPOSITION; DIFFERENTIAL SCANNING CALORIMETRY; ELECTROPLATING; GRAIN BOUNDARIES; HARDNESS; SULFURIC ACID; TRANSMISSION ELECTRON MICROSCOPY; X RAY SPECTROMETERS;

COPPER DEPOSIT ELECTROPLATING; THIOUREA; X-RAY SPECTROMETERS;

UREA;

ANNEALING; COPPER; ELECTROPLATING; SULFURIC ACID;

EID: 4444384602 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2004.04.028 Document Type: Article

Times cited : (23)

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