Oxidation mechanism of Cu2O to CuO at 600-1050 °C

Oxidation of Metals

Volumn 62, Issue 3-4, 2004, Pages 207-222

  Zhu, Y ^a   Mimura, K ^a   Isshiki, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Activation energies; Cu2O; CuO; Grain boundary diffusion; Oxidation; Oxidation rate law

Indexed keywords

ACTIVATION ENERGY; GRAIN BOUNDARIES; GRAIN GROWTH; IMPURITIES; OXIDATION; REACTION KINETICS; THERMODYNAMICS;

CU2O; GRAIN-BOUNDARY DIFFUSION; OXIDATION RATE LAW; OXIDE LAYERS;

COPPER OXIDES;

EID: 9144234802     PISSN: 0030770X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11085-004-7808-6     Document Type: Review

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