Improvement of interfacial and microstructure properties of high-k ZrO2 thin films fabricated by filtered cathodic arc deposition using nitrogen incorporation

Surface and Coatings Technology

Volumn 201, Issue 19-20 SPEC. ISS., 2007, Pages 8282-8285

  Huang, A P ^a   Di, Z F ^a   Fu, Ricky K Y ^a   Chu, Paul K ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Microstructure; Plasma nitridation; ZrO2

Indexed keywords

FILTERED CATHODIC ARC DEPOSITION; INTERFACIAL PROPERTIES; MICROSTRUCTURAL PROPERTIES; NITRIDED FILM; PLASMA NITRIDATION;

HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MICROSTRUCTURE; NITRIDATION; PLASMA APPLICATIONS; THERMODYNAMIC STABILITY; THIN FILMS; ZIRCONIUM COMPOUNDS;

DEPOSITION;

DEPOSITION; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MICROSTRUCTURE; NITRIDATION; PLASMA APPLICATIONS; THERMODYNAMIC STABILITY; THIN FILMS; ZIRCONIUM COMPOUNDS;

EID: 34447520151     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2006.09.330     Document Type: Article

References (19)

1. Aoki Y., and Kunitake T. Adv. Mater. 16 (2004) 118
2. Luo Z.J., Guo X., and Ma T.P. Appl. Phys. Lett. 79 (2001) 2803
3. Kuo D.H., and Tzeng K.H. Thin Solid Films 420 (2002) 497
4. Copel M., Gribelyuk M., and Gusev E. Appl. Phys. Lett. 76 (2000) 436
5. Jeon S.H., Choi C.J., Seong T.Y., and Hwang H.S. Appl. Phys. Lett. 79 (2001) 245
6. Wilk G.D., and Wallace R.M. Appl. Phys. Lett. 76 (2000) 112
7. Wang J.C., Shie D.C., Lei T.F., and Lee C.L. Electrochem. Solid-State Lett. 6 10 (2003) F34
8. Visokay M.R., Chambers J.J., Rotondaro A.L.P., Shanware A., and Colombo L. Appl. Phys. Lett. 80 (2002) 3183
9. Cho M.J., Park H.B., Park J.H., Lee S.W., and Hwang C.S. Appl. Phys. Lett. 83 (2003) 5503
10. Cho H.J., Kang C.S., Onishi K., Gopalan S., Nieh R., Choi R., Dharamarajan E., and Lee J.C. Tech. Dig. Int. Electron. Devices Meet. 6552001 (2001)
11. Fu R.K.Y., Mei Y.F., Shen L.R., Siu G.G., Chu P.K., Cheung W.Y., and Wong S.P. Surf. Coat. Technol. 186 (2004) 112
12. Jeynes C., Jafri Z.H., Webb R.P., Kimber A.C., and Ashwin M.J. Surf. Interface Anal. 25 (1997) 254
13. Asahi R., Morikawa T., Ohwaki T., Aoki K., and Taga Y. Science 293 (2001) 269
14. Phillippi C.M., and Mazdiyasni K.S. J. Am. Ceram. Soc. 54 (1971) 254
15. Pecharroman C., Ocan M., and Sena C.J. J. Appl. Phys. 80 (1996) 3479
16. Dfinek V., Bastl Z., Hbrt J., and Pola J. Appl. Surf. Sci. 108 (1997) 283
17. French R.H., Glass S.J., and Ohuchi F.S. Phys. Rev. B 49 (1994) 5133
18. Yu X.F., Zhu C.X., Chin A., Du A.Y., Wang W.D., and Kwong D.L. Appl. Phys. Lett. 85 14 (2004) 2893
19. Konofaos N., Evangelou E.K., Aslanoglou X., Kokkoris M., and Vlastou R. Semicond. Sci. Technol. 19 (2004) 50