Thermal cycle reliability of solder joints to alternate plating finishes

Circuit World

Volumn 25, Issue 2, 1999, Pages 27-30

  Johnson, R Wayne ^a   Wang, Vicky ^a   Palmer, Michael ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; FINISHING; GOLD; NICKEL; PALLADIUM; PLATING; PRINTED CIRCUIT MANUFACTURE; RELIABILITY; THERMAL CYCLING;

EUTECTIC SOLDER PASTE; HOT AIR SOLDER LEVEL; SURFACE FINISHING;

SOLDERED JOINTS;

EID: 0033298141     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056129910258306     Document Type: Article

References (5)

1. Beigle, S. (1996), "Non-precious metal coatings for fine pitch assembly and direct chip attachment", Proceedings of the 1996 Surface Mount International Technical Program, September 10-12, San Jose, CA, pp. 780-85.
2. Hillman, D., Bratin, P. and Pavlov, M. (1996), "Wire bondability and solderability of various metallic finishes for use in printed circuit assembly", Proceedings of the 1996 Surface Mount International Technical Program. September 10-12, San Jose, CA, pp. 687-701.
3. Houghton, B. (1997), "Alternative metallic finishes for PWB - an ITRI/October project", Proceedings of the IPC EXPO, March, pp. S16-4-1.
4. Mei, Z. and Callery, P. (1997), "Mechanical reliability and failure analysis of mid-range BGA packages soldered on electroless Ni/immersion Au and organic coated Cu", Proceedings of the 9th Symposium on Mechanics of Surface Mount, ASME Annual Meeting, November.
5. Milad, G. (1996), "Surface finishes: metallic coatings over nickel over copper", Proceedings of the 1996 Surface Mount International Technical Program, September 10-12, San Jose, CA, pp. 794-6.