A Potential Drop-In Replacement for Eutectic Sn-Pb Solder - The Sn-Zn-Ag-Al-Ga Solder

Journal of Electronic Materials

Volumn 32, Issue 12, 2003, Pages 1490-1495

  Lin, Kwang Lung ^a   Chen, Kang I ^a   Shi, Po Cheng ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Elongation; Microstructure; Oxidation resistance; Pb free solder; Sn Zn; Tensile strength; Wetting

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; EUTECTICS; GALLIUM; LEAD; MICROSTRUCTURE; ORGANIC ACIDS; OXIDATION; STRAIN; STRESSES; TENSILE STRENGTH; TIN ALLOYS; WETTING;

ELONGATION; PB-FREE SOLDERS; SNZN;

SOLDERING ALLOYS;

EID: 0942277783     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0119-x     Document Type: Conference Paper

References (29)

1. I.E. Anderson and R.L. Terpstra, U.S. patent 6,231,691 (15 May 2001).
2. M. Hansen and K. Anderko, Constitution of Binary Alloy, 2nd ed. (New York: McGraw-Hill, 1985), pp. 52-54.
3. R.J.K. Wassink, Soldering in Electronics, 2nd ed. (Ayr, Scotland: Electrochemical Publications, 1989), p. 207.
4. Y. Miyazawa and T. Ariga, 1st Int. Symp. on Environmentally Conscious Design and Inverse Manufacturing (Los Alamitos, CA: IEEE Computer Society, 1999), pp. 616-619.
5. H. Mavoori, S. Vaynman, J. Chin, B. Moran, L.M. Keer, and M.E. Fine, Mater. Res. Soc. Proc. 390, 161 (1995).
6. J. Glazer, J. Electron. Mater. 23, 693 (1994).
7. E.P. Wood and K.L. Nimmo, J. Electron. Mater. 23, 709 (1994).
8. H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer, and M. Fine, J. Electron. Mater. 26, 783 (1997).
9. J. Foley, A. Gickler, F.H. Leprevost, and D. Brown, J. Electron. Mater. 29, 1258 (2000).
10. C.M. Chuang, T.S. Lui, and L.H. Chen, J. Electron. Mater. 30, 1232 (2001).
11. M.E. Loomans, S. Vaynman, G. Ghosh, and M.E. Fine, J. Electron. Mater. 23, 741 (1994).
12. M. McCormack and S. Jin, J. Electron. Mater. 23, 635 (1994).
13. M.L. Huang, C.M.L. Wu, J.K.L. Lai, L. Wang, and F.G. Wang, J. Mater. Sci.: Mater. Electron. 11, 57 (2000).
14. K. Suganuma, K. Niihara, T. Shoutoku, and Y. Nakamura, J. Mater. Res. 13, 2859 (1998).
15. K. Suganuma, T. Murata, H. Noguchi, and Y. Toyoda, J. Mater. Res. 15, 884 (2000).
16. H.M. Lee, S.W. Yoon, and B.J. Lee, J. Electron. Mater. 27, 1161 (1998).
17. W.L. Lin, L.H. Wen, and T.P. Liu, J. Electron Mater. 27, 1007 (1998).
18. K.L. Lin and L.H. Wen, J. Mater. Sci.: Mater. Electron. 9, 5 (1998).
19. K.L. Lin and Y.C. Wang, J. Electron. Mater. 27, 1205 (1998).
20. S.P. Yu, H.C. Wang, M.H. Hon, and M.C. Wang, JOM 52, 36 (2000).
21. S.P. Yu, M.C. Wang, and M.H. Hon, J. Mater. Res. 16, 76 (2001).
22. K.L. Lin and T.P. Liu, Mater. Chem. Phys. 56, 171 (1998).
23. M. McCormack and S. Jin, J. Electron. Mater. 23, 715 (1994).
24. T.J. Andersen and I. Ansara, J. Phase Equilibria 13, 181 (1992).
25. J. Dutkiewicz, Z. Moser, L. Zabdyr, D.D. Gohil, T.G. Chart, I. Ansara, and C. Girard, Bull. Alloy Phase Diagrams 11, 77 (1990).
26. M.B. Baren, Bull. Alloy Phase Diagrams 11, 334 (1990).
27. J.L. Murray, Bull. Alloy Phase Diagrams 4, 183 (1983).
28. K.I. Chen and K.L. Lin, J. Electron. Mater. 31, 861 (2002).
29. K.L. Lin and H.M. Shu, J. Electron. Mater. 30, 1068 (2001).