Microstructure and mechanical properties of low Ga content Sn-8.55Zn-0.5Ag-0.1Al-xGa solders

Scripta Materialia

Volumn 52, Issue 5, 2005, Pages 369-374

  Liu, Nai Shuo ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Mechanical properties; Melting point; Microstructure; Sn Zn

Indexed keywords

ALUMINUM; DIFFERENTIAL SCANNING CALORIMETRY; DIFFRACTOMETERS; GALLIUM; GRAIN BOUNDARIES; HEAT TRANSFER; MICROANALYSIS; MICROSTRUCTURE; OXIDATION; QUENCHING; SCANNING ELECTRON MICROSCOPY; SILVER; TIN; WETTING; X RAY DIFFRACTION; ZINC;

ELECTRONIC ASSEMBLIES; MELTING POINT; SN-ZN; SOLDERABILITY;

SOLDERING ALLOYS;

EID: 10644263029     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2004.10.033     Document Type: Article

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