Microstructures and mechanical properties of Sn-8.55Zn-0.45Al-XAg solders

Journal of Materials Research

Volumn 18, Issue 7, 2003, Pages 1528-1534

  Huang, Chia Wei ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; DUCTILITY; EUTECTICS; MECHANICAL PROPERTIES; MELTING; METALLOGRAPHIC MICROSTRUCTURE; SOLDERING ALLOYS; TENSILE STRENGTH; THERMOANALYSIS;

HYPOEUTECTIC STRUCTURE; MELTING POINT; SILVER ZINC COMPOUNDS; TIN ZINC ALUMINUM TUNGSTEN SOLDER;

TIN ALLOYS;

EID: 0043199518     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2003.0211     Document Type: Article

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