Controlling impurity levels of copper electrodeposited films in the damascene process

Advanced Metallization Conference (AMC)

Volumn 2006, Issue , 2006, Pages 137-143

  Meunier, Anthony ^a,b   Bondoux, Céline ^a   Omnès, Laurent ^b   Jomard, François ^c   Etcheberry, Arnaud ^a  

^a UNIVERSITÉ DE VERSAILLES SAINT QUENTIN EN YVELINES   (France)

^b Rockwood Electronic Materials   (France)

^c Centre National de la Recherche Scientifique   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COPPER; ELECTROCHEMISTRY; ELECTROPLATING; KINETIC THEORY; OPTICAL INTERCONNECTS;

COPPER ELECTROPLATING; ELECTRODEPOSITED FILMS; SUPERFILLING; VOID FREE FILLING;

OPTICAL FILMS;

EID: 33947263705     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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