Microstructural study of the effect of chloride ion on electroplating of copper in cupric sulfate-sulfuric acid bath

Journal of the Electrochemical Society

Volumn 152, Issue 9, 2005, Pages

  Kao, Y L ^a   Li, K C ^b   Tu, G C ^a   Huang, C A ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHLORIDE MINERALS; CRYSTALLIZATION; MICROSTRUCTURE; POLARIZATION; SULFURIC ACID; TRANSMISSION ELECTRON MICROSCOPY;

CHLORIDE IONS; COPPER DEPOSIT; ELECTROCRYSTALLIZATION; SULFATE-SULFURIC ACID;

ELECTROPLATING;

EID: 25644431962     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1984352     Document Type: Article

References (33)

1. W. H. Gauvin and C. A. Winkler, J. Electrochem. Soc., 99, 71 (1952).
2. J. J. Kelly and A. C. West, J. Electrochem. Soc., 145, 3472 (1998).
3. A. V. Benedetti, P. T. A. Sumodjo, K. Nobe, P. L. Cabot, and W. G. Proud, Electrochim. Acta, 40, 2657 (1995).
4. S. Goldbach, W. Messing, T. Daenen, and F. Liapicque, Electrochim. Acta, 44, 323 (1998).
5. M. Fonsati, F. Zucchi, and G. Trabanelli, Electrochim. Acta, 44, 311 (1998).
6. S. Yoon, M. Schwartz, and K. Nobe, Plat. Surf. Finish., 81, 65 (1994).
7. S. Yoon, M. Schwartz, CEF, and K. Nobe, Plat. Surf. Finish., 82, 64 (1994).
8. R. Walker and S. D. Cook, Surf. Technol., 11, 189 (1980).
9. G. Carneval and J. Bebczuk de Cusminsky, J. Electrochem. Soc., 128, 1215 (1981).
10. M. Peykova, E. Michailova, D. Stoychev, and A. Milchev, Electrochim. Acta, 40, 2595 (1995).
11. N. Pradhan, P. G. Krishna, and S. C. Das, Plat. Surf. Finish., March, 56 (1996).
12. P. V. Brande and R. Winand, Surf. Coat. Technol., 52, 1 (1992).
13. F. A. Harraz, T. Sakka, and Y. H. Ogata, Electrochim. Acta, 47, 1249 (2002).
14. C. Gabrielli, P. Mocoteguy, H. Perrot, and R. Wiart, J. Electroanal. Chem., 572, 367 (2004).
15. M. Alodan and W. H. Smyrl, Electrochim. Acta, 44, 299 (1998).
16. T. J. O'Keefe and L. R. Hurst J. Electroanal. Chem., 8, 109 (1978).
17. A.-M. Lafront, B. Veilleux, and E. Ghali, J. Appl. Electrochem., 32, 329 (2002).
18. R. Winand, in Application of Polarization Measurements in the Control of Metal Deposition, I. H. Warren Editor, p. 47, Elsevier, Amsterdam (1984).
19. R. Winand, Electrochim. Acta, 43, 2925 (1998).
20. A. Wu and D. P. Barkey, J. Electroanal. Chem., 150, C533 (2003).
21. E. D. Eliadis, Ralph G. Nuzzo, Andrew A. Gewirth, and Richard C. Alkire, J. Electrochem. Soc., 144, 96 (1997).
22. D. Grujicic and B. Pesic, Electrochim. Acta, 47, 2901 (2002).
23. Chi-Chang Hu and Chi-Ming Wu, Surf. Coat. Technol., 176, 75 (2003).
24. M. Kang and A. A. Gewirth, J. Electrochem. Soc., 150, C426 (2003).
25. B. Veilleux, A.-M. Lafront, and E. Ghali, Can. Metall. Q., 141, 47 (2002).
26. Z. Nagy, J. P. Blaudeau, N. C. Hung, L. A. Curtiss, and D. J. Zurawski, J. Electrochem. Soc., 142, L87 (1995).
27. D. N. Upadhyay and V. Yegnaraman, Mater. Chem. Phys., 62, 247 (2000).
28. M. H. Holzle, C. W. Apsel, T. Will, and D. M. Kolb, J. Electrochem. Soc., 142, 3741 (1995).
29. G. Fabricius, and G. Sundholm, J. Appl. Electrochem., 15, 797 (1985).
30. T. Pearson and J. K. Dennis, J. Appl. Electrochem., 20, 196 (1990).
31. D. M. Soares, S. Wasle, K. G. Weil, and K. Doblhofer, J. Electroanal. Chem., 532, 353 (2002).
32. D. Stoichev and C. Tsvetsanov, J. Appl. Electrochem., 26, 741 (1996).
33. J. D. Reid and A. P. David, Plat. Surf. Finish., 74, 66 (1987).