The structures of low dielectric constant SiOC thin films prepared by direct and remote plasma enhanced chemical vapor deposition

Thin Solid Films

Volumn 515, Issue 12, 2007, Pages 5035-5039

  Heo, Jaeyeong ^a   Kim, Hyeong Joon ^a   Han, JeongHoon ^b   Shon, Jong Won ^b  

^a Seoul National University   (South Korea)

^b Jusung Engineering Company Limited   (South Korea)

Author keywords

FT IR; Low k; Structure; XPS

Indexed keywords

CHEMICAL BONDS; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POLARIZATION; SILICON COMPOUNDS;

DIRECT PLASMA MODES; LOW-K; ORGANOSILICATES; OXYGEN ATOMS;

THIN FILMS;

EID: 33947242947     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.10.095     Document Type: Article

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