Effect of internal stresses on thermo-mechanical stability of interconnect structures in microelectronic devices

Materials Science and Engineering: A

Volumn 421, Issue 1-2, 2006, Pages 118-132

  Dutta, I ^a   Park, C ^a   Vella, J ^b  

^a Naval Postgraduate School   (United States)

^b FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

Back end structure; Cu interconnects; Interfacial sliding; Low K dielectric; Plasticity; Thermo mechanical cycling

Indexed keywords

COPPER; DIELECTRIC PROPERTIES; OPTICAL INTERCONNECTS; PACKAGING; PLASTICITY; SHEAR STRESS; THERMAL CYCLING;

IN-PLANE (IP); INTERFACIAL SLIDING; OUT-OF-PLANE (OOP); SHEAR-LAG BASED MODEL; THERMO-MECHANICAL CYCLING;

MICROELECTRONICS;

COPPER; DIELECTRIC PROPERTIES; MICROELECTRONICS; OPTICAL INTERCONNECTS; PACKAGING; PLASTICITY; SHEAR STRESS; THERMAL CYCLING;

EID: 33846458686     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.10.010     Document Type: Article

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