Effect of diffusionally accommodated interfacial sliding on the stress and deformation in copper/polyimide high density interconnects

Mechanics of Materials

Volumn 31, Issue 5, 1999, Pages 317-329

  Gosz, M ^a   Okyar, A F ^a  

^a Illinois Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DEFORMATION; DISSIMILAR MATERIALS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); POLYIMIDES; SHEAR STRESS; STRESS ANALYSIS; THERMAL STRESS;

HIGH DENSITY INTERCONNECTS; INTERFACIAL SLIDING;

ELECTRIC CONDUCTORS;

EID: 0032649895     PISSN: 01676636     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-6636(99)00003-4     Document Type: Article

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