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Volumn 2, Issue , 2004, Pages 137-144

Modeling of interfacial sliding and film crawling in back-end structures of microelectronic devices

Author keywords

Back end structure; Cu interconnects; Interfacial sliding; Low K dielectric; Plasticity; Thermo mechanical cycling

Indexed keywords

BACK-END STRUCTURE; CU INTERCONNECTS; INTERFACIAL SLIDING; LOW-K DIELECTRIC; THERMO-MECHANICAL CYCLING;

EID: 4444344329     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (1)

References (18)
  • 10
    • 4444224708 scopus 로고    scopus 로고
    • An environmentally protected hot-stage AFM for studying thermo-mechanical deformation in microelectronic devices
    • in press
    • C. Park, T.E. Shultz and I. Dutta, "An Environmentally Protected Hot-Stage AFM for Studying Thermo-Mechanical Deformation in Microelectronic Devices", Rev. Sci. Instrum., in press.
    • Rev. Sci. Instrum.
    • Park, C.1    Shultz, T.E.2    Dutta, I.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.