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Volumn 2, Issue , 2004, Pages 137-144
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Modeling of interfacial sliding and film crawling in back-end structures of microelectronic devices
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Author keywords
Back end structure; Cu interconnects; Interfacial sliding; Low K dielectric; Plasticity; Thermo mechanical cycling
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Indexed keywords
BACK-END STRUCTURE;
CU INTERCONNECTS;
INTERFACIAL SLIDING;
LOW-K DIELECTRIC;
THERMO-MECHANICAL CYCLING;
ATOMIC FORCE MICROSCOPY;
COMPUTER SIMULATION;
COPPER COMPOUNDS;
DEFORMATION;
DIELECTRIC DEVICES;
DIFFUSION;
FLIP CHIP DEVICES;
INTERFACES (MATERIALS);
RELIABILITY;
SENSITIVITY ANALYSIS;
THIN FILMS;
MICROELECTRONICS;
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EID: 4444344329
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (1)
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References (18)
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