Interfacial sliding in back-end interconnect structures in microelectronic devices

Materials Research Society Symposium - Proceedings

Volumn 716, Issue , 2002, Pages 483-488

  Peterson, K A ^a   Park, C ^a   Dutta, I ^a  

^a Naval Postgraduate School ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CREEP; INTERCONNECTION NETWORKS; PLASTIC DEFORMATION; RELIABILITY THEORY; THERMAL CYCLING; THERMAL EXPANSION;

BACK END INTERCONNECT STRUCTURES; INTERFACIAL SLIDING; MICROELECTRONIC DEVICES;

MICROELECTRONICS;

EID: 0036951203     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-716-b11.6     Document Type: Conference Paper

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