Deformation and interfacial sliding in back-end interconnect structures in microelectronic devices

Journal of Electronic Materials

Volumn 32, Issue 10, 2003, Pages 1059-1071

  Park, C ^a   Dutta, I ^a   Peterson, K A ^a   Vella, J ^b  

^a Naval Postgraduate School ^*  (United States)

^b MOTOROLA INC   (United States)

Author keywords

Copper interconnects; Deformation; Interfacial sliding; Low K dielectric; Thermal cycling

Indexed keywords

ATOMIC FORCE MICROSCOPY; CREEP; DIELECTRIC MATERIALS; MICROELECTRONICS; PLASTIC DEFORMATION; SILICON; THERMAL CYCLING; THERMAL EXPANSION;

COPPER INTERCONNECTS; INTERFACIAL CREEP; INTERFACIAL SLIDING; LOW-K DIELECTRIC;

COPPER;

EID: 0242368000     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0089-z     Document Type: Article

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