Environmentally protected hot-stage atomic force microscope for studying thermo-mechanical deformation in microelectronic devices

Review of Scientific Instruments

Volumn 75, Issue 11, 2004, Pages 4662-4670

  Park, C ^a   Shultz, T E ^a   Dutta, I ^a  

^a Naval Postgraduate School ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP-LEVEL INTERCONNECT STRUCTURES; DISPLACEMENT CALIBRATION; PROPORTIONAL-INTEGRAL-DIFFERENTIAL (PID) CONTROLLER; SAMPLE HEATER CONTROLLER;

ATOMIC FORCE MICROSCOPY; CONTROL SYSTEMS; DEFORMATION; ELECTRONICS PACKAGING; HEATING; MICROPROCESSOR CHIPS; SOLDERED JOINTS; THERMAL EXPANSION; THERMOANALYSIS; THIN FILMS;

MICROELECTRONICS;

EID: 10844292436     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1809262     Document Type: Article

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