Interfacial sliding and plasticity in back-end interconnect structures of microelectronic devices

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 83-90

  Dutta, I ^a   Park, C ^a   Vella, J ^b   Pan, D ^a  

^a Naval Postgraduate School   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMO-MECHANICALLY PLANARIZATION (CMP); COEFFICIENT OF THERMAL EXPANSION (CTE); INTERCONNECT STRUCTURES; INTERFACIAL SLIDING;

ATOMIC FORCE MICROSCOPY; COPPER; DIELECTRIC MATERIALS; DIFFUSION; INTERCONNECTION NETWORKS; INTERFACES (MATERIALS); PLASTICITY; SHEAR DEFORMATION;

MICROELECTRONICS;

EID: 3843075249     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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