AFM studies of deformation and interfacial sliding in interconnect structures in microelectronic devices

Materials Research Society Symposium - Proceedings

Volumn 766, Issue , 2003, Pages 385-390

  Park, C ^a   Dutta, I ^a   Peterson, K A ^a   Vella, J ^b  

^a Naval Postgraduate School   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COMPUTER SIMULATION; DEFORMATION; DIELECTRIC MATERIALS; INTERFACES (MATERIALS); THERMAL CYCLING; THERMAL EXPANSION; THERMODYNAMIC STABILITY;

INTERCONNECT STRUCTURE; INTERFACIAL SLIDING; SHEAR LAG BASED MODEL; THERMAL EXCURSIONS;

MICROELECTRONICS;

EID: 0348199012     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-766-e4.11     Document Type: Conference Paper

References (15)

1. M.D. Thouless, J. Gupta, and J.M.E. Harper, J. Mater. Res., 8, 1845 (1993).
2. K.A. Peterson, C. Park and I. Dutta, MRS Symp. Proc., 716, 483 (2002).
3. M.W. Chen, and I. Dutta, Appl. Phys. Lett., 77, 4298 (2000).
4. I. Dutta, M.W. Chen, K. Peterson and T. Shultz, J. Electron. Mater., 30, 1537 (2001).
5. I. Dutta, K. Peterson and M.W. Chen, Proc. Plasticity '02, NEAT Press, 117 (2002).
6. D.V. Zhmurkin, T.S. Gross, and L.P. Buchwalter, J. Electron. Mater., 26, 791 (1997).
7. M. Huang, Z. Suo and Q. Ma, Acta Mater., 49, 3039 (2001).
8. L.M. Gignac, K.P. Rodbell, C. Cabral, P.C. Andricacos, P.M. Rice, R.B. Beyers, P.S. Locke, S.J. Klepeis, Mater. Res. Soc. Symp., 564, 373 (1999).
9. P. A. Flinn, J. Mater. Res., 6, 1498 (1991).
10. J.V. Funn, and I. Dutta, Acta Mater., 47, 149 (1999).
11. K. Peterson, I. Dutta and M.W. Chen, Scripta Mater., 47, 649 (2002).
12. K. A. Peterson, I. Dutta and M.W. Chen, Acta Mater., 51, in press (2003).
13. R. Raj and M.F. Ashby, Metall. Trans. 2, 1113 (1971).
14. I. Dutta, Acta Mater., 48, 1055 (2000).
15. P.S. Ho, K.D. Lee, E. Ogawa, X. Lu, H. Matsuhashi, V. Blaschke, R. Augur, Proc. IEDM'02, 741 (2002).