Interfacial sliding in Cu/Ta/polyimide high density interconnects as a result of thermal cycling

Journal of Electronic Materials

Volumn 26, Issue 7, 1997, Pages 791-797

  Zhmurkin, D V ^a   Gross, T S ^a   Buchwalter, L P ^b  

^a Univ of New Hampshire   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Atomic force microscope; Interconnects; Polyimide; Stress relaxation; Thermal deformation

Indexed keywords

ASPECT RATIO; ATOMIC FORCE MICROSCOPY; COPPER; DEFORMATION; GRAIN BOUNDARIES; INTERFACES (MATERIALS); POLYIMIDES; SILICON WAFERS; STRESS RELAXATION; TANTALUM; THERMAL CYCLING; THERMAL EFFECTS;

HIGH DENSITY INTERCONNECTS; INTERFACIAL SLIDING;

ELECTRIC CONNECTORS;

EID: 0031189664     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-997-0253-y     Document Type: Article

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