An investigation of smooth nanosized copper films on glass substrate by improved electroless plating

Surface Review and Letters

Volumn 13, Issue 4, 2006, Pages 471-478

  Huiping, Zhang ^a   Zhonghao, Jiang ^a   Xianli, Liu ^a   Jianshe, Lian ^a  

^a NONE

Author keywords

Cu film; Electroless plating; Glass substrate; Resistivity

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; GLASS; GRAIN SIZE AND SHAPE; NANOSTRUCTURED MATERIALS; TEXTURES; X RAY ANALYSIS;

DEPOSITION TIME; DIFFRACTION INTENSITY; GLASS SUBSTRATE; NANOSIZED COPPER FILMS;

METALLIC FILMS;

EID: 33846384093     PISSN: 0218625X     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0218625X0600844X     Document Type: Article

References (22)

1. Y. Shacham-Diamand and V. M. Dubin, Microelectron. Eng. 33 (1997) 47.
2. V. M. Dubin, Y. Shacham-Diamand, B. Zhao, P. K. Vasudev and C. H. Ting, J. Electrochem. Soc. 144 (1997) 898.
3. H.-K. Kang, J. S. H. Cho and S. S. Wong, IEEE Elec. Dev. Lett. 13 (1992) 448.
4. Y. Shacham-Diamand, A. Inberg, Y. Sverdlov, V. Bogush, N. Croitoru, H. Moscovich and A. Freeman, Electrochim. Acta 48 (2003) 2987.
5. Y. Shacharn-Diarnand, V. Dubin and M. Angyal, Thin Solid Films 262 (1995) 93.
6. Y. Shacham-Diamand and S. Lopatin, Electrochim. Acta 44 (1999) 3639.
7. Y. C. Ee, Z. Chen, L. Chan, A. K. H. Sec, S. B. Law, K. C. Tee, K. Y. Zeng and L. Shen, Thin Solid Films 462-463 (2004) 197.
8. R. S. Lin, C. G. You, M. S. Tsai, S. F. Hu, Y. H. Li and C. P. Lu, Solid State Commun. 125 (2003) 445.
9. Y. A. Yang, Y. B. Wei, B. H. Loo and J. N. Yao, J. Electroanal. Chem. 462 (1999) 259.
10. H. Yoshiki, K. Hashimoto and A. Fujishima, Metal Finishing 1 (1996) 28.
11. Y. M. Lin and S. C. Yen, Appl. Surf. Sci. 178 (2001) 116.
12. K. K. Choi and S. W. Rhee, Thin Solid Films 397 (2001) 70.
13. F. Hanna, Z. A. Hamid and A. A. Aal, Mater. Lett. 58 (2003) 104,
14. M. Radoeva and B. Radoev, J. Mater. Sci. 30 (1995) 2215.
15. S. P. Chong, Y. C. Ee, Z. Chen and S. B. Law, Surf. Coat. Technol. 198 (2005) 287.
16. C. Ryu, K. W. Kwon, A. L. S. Loke, H. Lee, T. Nogami, V. M. Dubin, R. A. Kavari, G. W. Ray and S. S. Wong, IEEE Trans. Elec. Dev. 46 (1999) 1113.
17. D. Wolf, Acta Met. Mater. 38 (1990) 781.
18. V. M. Kozlov and L. P. Bicelli, Mater. Chem. Phys. 77 (2002) 289.
19. D. Dayal, H. U. Finzel and P. WiBmann, Thin Metal Films and Gas Chemisorption (Elsevier, Amsterdam, 1987), p. 53.
20. M. Radoeva, B. Radoev and K. W. Stckelhuber, J. Mater. Sci. 38 (2003) 2703.
21. J. M. Camacho and A. I. Oliva, Microelectron. J. 36 (2005) 555.
22. L. Lu, Y. F. Sheu, X. H. Chen, L. H. Qian and K. Lu, Science 304 (2004) 422.