An investigation of smooth nano-sized copper seed layers on TiN and TaSiN by new non-toxic electroless plating

Solid State Communications

Volumn 125, Issue 7-8, 2003, Pages 445-448

  Liu, R S ^a   You, C C ^a   Tsai, M S ^b   Hu, S F ^b   Li, Y H ^c   Lu, C P ^c  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^c Merck Kanto Advanced Chemicals Ltd   (Taiwan)

Author keywords

A. Nanostructures; B. Nanofabrications copper

Indexed keywords

AMORPHOUS SILICON; COPPER; ELECTROLESS PLATING; HEAT STABILIZERS; NANOTECHNOLOGY; NUCLEATION; SURFACE ACTIVE AGENTS; SURFACE CHEMISTRY; TANTALUM COMPOUNDS; THERMAL EFFECTS; TITANIUM NITRIDE;

COMPLEXING AGENTS;

NANOSTRUCTURED MATERIALS;

EID: 0037303599     PISSN: 00381098     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1098(02)00821-9     Document Type: Article

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