Characterization of the bending creep behavior for electroplating nickel microbeam

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages 195-202

  Tsou, C ^a   Hsu, C ^b   Fang, W ^b   Lai, T S ^a   Li, H C ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; ELASTIC MODULI; ELECTROPLATING; INDENTATION; MECHANICAL TESTING; MICROMACHINING; NICKEL;

BENDING TESTS; MICRO CANTILEVER; NANOINDENTATION; NICKEL FILMS;

METALLIC FILMS;

EID: 33846293959     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564667     Document Type: Conference Paper

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