Electroless nickel films: Properties and fabricated cavity structure

Journal of Microelectromechanical Systems

Volumn 11, Issue 4, 2002, Pages 293-301

  Yi, Seung Hwan ^a,b,c   Von Preissig, Fred J ^a,b   Kim, Eun Sok ^a,d  

^a IEEE   (South Korea)

^b University of Hawaii at Manoa   (United States)

^c R and D GE Thermometries Technologies Ltd   (South Korea)

^d University of Southern California   (United States)

Author keywords

Bulge test; Cavity; Electroless nickel; Film; MEMS; Microstructure; Parylene; Stiction; Stress

Indexed keywords

ELECTROLESS NICKEL FILMS;

COMPRESSIVE STRESS; CRYSTALLINE MATERIALS; ELASTIC MODULI; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; NICKEL; STRESS ANALYSIS;

THICK FILMS;

EID: 0036686443     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2002.800614     Document Type: Article

References (24)

1. Geometrical effects in the electroless metallization of fine patterns
2. Nickel-filled hexsil thermally actuated tweezers
3. Stabilizer concentration and local environment
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6. The Effect of bath pH and operating temperature on the composition of electroless nickel deposits
7. Electrostatic parallelogram actuator
8. Supercritical carbon dioxide drying of microstructure
9. Fabrication of dome-shaped diaphragm with circular clamped boundary on silicon substrate
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11. Advanced bulge test system
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14. Fabrication of nickel micromechanical structures using a simple low-temperature electroless plating process
15. The parylene-aluminum multilayer interconnection system for wafer scale integration and wafer scale hybrid packaging
16. Structure of electroless nickel coating
17. The crystallization of an electroless Ni-P deposit
18. A calorimetric study of the electroless deposition of nickel