Understanding and tailoring the mechanical properties of LIGA fabricated materials

Materials Research Society Symposium - Proceedings

Volumn 546, Issue , 1999, Pages 121-126

  Buchheit, T E ^a   Christenson, T R ^a   Schmale, D T ^a   Lavan, D A ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; COMPRESSION TESTING; COPPER; ELECTRODEPOSITION; METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; NICKEL; TEXTURES;

LENTICULAR MICROSTRUCTURAL MORPHOLOGY;

MICROELECTROMECHANICAL DEVICES;

EID: 0033324043     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. E.W. Becker, W. Ehrfled, P. Hagmann, A Maner, and D. Munchmeyer, Microelectronic Eng.. 4, pp 35-56 (1986).
2. T.R. Christenson and H. Guckel in Micromahcing in and Microfabrication Process Technology (SPIE Proceedings, 2639, Austin, Tx, 1995) pp. 134-145.
3. M.L. Whitehurst in Symposium on Electrodeposited Metals as Materials for Selected Applications (MCIC-72-05 report for Metals and Ceramics Information Center, Airforce Materials Laboratory, 1972), pp. 53-64.
4. W. H. Safranek, The Properties of Electrodeposited Metals and Alloys. (American Electroplaters and Surface finishers Society, Orlando Fl, 1986.
5. D.T. Schmale, R.J. Bourcier and T.E. Buchheit, Description of a Micromechanical Testing System, SAND971608 (Sandia National Laboratories, Albuquerque, NM, 1997)
6. T.R. Christenson, T.E. Buchheit, D.T. Schmale and R J. Bourcier in Microelectromechanical Structures for Materials Research (Mater. Res. Soc. Proc.) to be published.
7. W.C. Oliver and G.M. Pharr, J. Mater. Res., 7, pp. 1564-1583, (1992).