An inlaid electroplated copper coil for on-chip powering of microelectromechanical systems devices

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 2, 2004, Pages 611-618

  Wu, Jie ^a   Bernstein, Gary H ^a  

^a University of Notre Dame   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC COILS; ELECTRIC POTENTIAL; ELECTRIC RESISTANCE; ELECTROMAGNETIC WAVES; ELECTROPLATING; ENERGY STORAGE; INTEGRATED CIRCUITS; LITHOGRAPHY; MICROELECTROMECHANICAL DEVICES; MICROPROCESSOR CHIPS; MICROSTRUCTURE; REACTIVE ION ETCHING; SILICON; THIN FILMS;

INTEGRATED COILS; POWER TRANSFER EFFICIENCY; TEMPERATURE DIFFERENCES; WIRE TETHERING;

COPPER;

EID: 2342472017     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1667505     Document Type: Article

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