Hybrid mold reversal imprint for three-dimensional and selective patterning

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 24, Issue 6, 2006, Pages 2968-2972

  Peng, C ^a   Pang, S W ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HYBRID MOLD; THREE-DIMENSIONAL (3D) NANOSTRUCTURES; UV LITHOGRAPHY;

ACTUATORS; OPTICAL SENSORS; PHOTOLITHOGRAPHY; SUBSTRATES;

NANOSTRUCTURED MATERIALS;

EID: 33845270218     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2366676     Document Type: Article

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