A combined-nanoimprint-and-photolithography patterning technique

Microelectronic Engineering

Volumn 71, Issue 3-4, 2004, Pages 277-282

  Cheng, Xing ^a   Guo, L Jay ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Nanoimprint; Nanopatterning; Near field effect; Photolithography

Indexed keywords

ASPECT RATIO; ETCHING; MOLDING; PHOTOLITHOGRAPHY; PRESSURE EFFECTS; THERMAL EFFECTS; THERMOPLASTICS; ULTRAVIOLET RADIATION;

NANOIMPRINT LITHOGRAPHY; NANOPATTERNING; NEAR-FIELD EFFECTS;

NANOTECHNOLOGY;

EID: 1842639896     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.01.041     Document Type: Article

References (8)

1. Chou S.Y., Krauss P.R., Renstrom P.J. Appl. Phys. Lett. 67:1995;3114.
2. Chou S.Y., Krauss P.R., Renstrom P.J. Science. 272:1996;85.
3. Colburn M., Johnson S., Stewart M., Damle S., Bailey T., Choi B., Wedlake M., Michaelson T., Sreenivasan S.V., Ekerdt J., Willson C.G. Proc. of SPIE. 3676:1999;379.
4. Chou S.Y., Krauss P.R., Zhang W., Guo L., Zhuang L. J. Vac. Sci. Technol. B. 15:1997;2897.
5. Otto M., Bender M., Hadam B., Spangenberg B., Kurz H. Microelectron. Eng. 57-58:2001;361.
6. Kunz R.R., Rothschild M., Yeung M.S. J. Vac. Sci. Technol. B. 21:2003;78.
7. Goodberlet J.G., Kavak H. Appl. Phys. Lett. 81:2002;1315.
8. Schmid H., Biebuyck H., Michel B., Martin O.J.F. Appl. Phys. Lett. 72:1998;2379.