Three-dimensional pattern transfer and nanolithography: Modified soft molding

Applied Physics Letters

Volumn 81, Issue 6, 2002, Pages 1011-1013

  Kim, Y S ^a   Park, Joonhyung ^a   Lee, Hong H ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

MOLDING TECHNIQUES; SOFT MOLDING; THREE-DIMENSIONAL PATTERNS; THREE-DIMENSIONAL POLYMER STRUCTURES; THREE-DIMENSIONAL STRUCTURE;

MOLDING; POLYMER FILMS; THREE DIMENSIONAL;

REACTIVE ION ETCHING;

EID: 79956024799     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1498149     Document Type: Article

References (9)

1. Y. Xia and G. M. Whitesides, Annu. Rev. Mater. Sci. 28, 153 (1998). arm ARMSCX 0084-6600
2. E. Kim, Y. Xia, X.-H. Zhao, and G. M. Whitesides, Adv. Mater. 9, 651 (1997). amt ADVMEW 0935-9648
3. C. Marzolin, S. P. Smith, M. Prentiss, and G. M. Whitesides, Adv. Mater. 10, 571 (1998). amt ADVMEW 0935-9648
4. M. Li, L. Chen, and S. Y. Chou, Appl. Phys. Lett. 78, 3322 (2001). apl APPLAB 0003-6951
5. S. Y. Chou, P. R. Krauss, and P. J. Renstrom, Appl. Phys. Lett. 67, 3114 (1995). apl APPLAB 0003-6951
6. D. Y. Khang, H. Yoon, and H. H. Lee, Adv. Mater. 13, 749 (2001). amt ADVMEW 0935-9648
7. H.-C. Scheer, H. Schult, T. Hoffmann, and C. H. Sotomayor Torres, J. Vac. Sci. Technol. B 16, 3917 (1998). jvb JVTBD9 0734-211X
8. K. Y. Suh, Y. S. Kim, and H. H. Lee, Adv. Mater. 13, 1386 (2001). amt ADVMEW 0935-9648
9. Y. S. Kim, K. Y. Suh, and H. H. Lee, Appl. Phys. Lett. 79, 2285 (2001). apl APPLAB 0003-6951