Improving electroless Cu via filling with optimized Pd activation

Applied Surface Science

Volumn 253, Issue 5, 2006, Pages 2357-2361

  Lau, P P ^a,b   Wong, C C ^a   Chan, L ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

Author keywords

Electroless copper; Palladium activation; Via filling

Indexed keywords

CHEMICAL ACTIVATION; ELECTROLESS PLATING; GROWTH (MATERIALS); NUCLEATION; OPTIMIZATION; PALLADIUM;

ELECTROLESS COPPER; PALLADIUM ACTIVATION; VIA FILLING;

COPPER;

EID: 33751427782     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2006.05.001     Document Type: Review

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