Sequential observation of electroless copper deposition via noncontact atomic force microscopy

Journal of the Electrochemical Society

Volumn 145, Issue 9, 1998, Pages 3301-3307

  Ng, H T ^a   Li, S F Y ^a   Chan, L ^a   Loh, F C ^a   Tan, K L ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CATALYSTS; COPPER PLATING; GRAIN GROWTH; METALLIC FILMS; MORPHOLOGY; NUCLEATION; PALLADIUM; TITANIUM NITRIDE; VAPOR DEPOSITION; VIBRATION CONTROL;

PHYSICAL VAPOR DEPOSITION;

ELECTROLESS PLATING;

EID: 0032165230     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838800     Document Type: Article

References (60)