Plasma etching of copper films at low temperature

Microelectronic Engineering

Volumn 84, Issue 1, 2007, Pages 105-108

  Tamirisa, P A ^a   Levitin, G ^a   Kulkarni, N S ^b   Hess, D W ^a  

^a Georgia Institute of Technology   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

Copper etching; Copper plasma etching

Indexed keywords

ABSORPTION SPECTROSCOPY; COPPER; COPPER COMPOUNDS; LOW TEMPERATURE EFFECTS; PLASMA ETCHING; THICK FILMS; THIN FILMS; VAPORIZATION; X RAY PHOTOELECTRON SPECTROSCOPY;

FLAME ATOMIC ABSORPTION SPECTROSCOPY; THERMOCHEMICAL ANALYSIS;

METALLIC FILMS;

EID: 33751417787     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.08.012     Document Type: Article

References (25)

1. Brewer L., and Lofgren N.L. J. Am. Chem. Soc. 72 (1950) 3038
2. Guido M., Balducci G., Gigli G., and Spoliti M. J. Chem. Phys. 55 (1971) 4566
3. Ryan J.G., and Geffken J.G. IBM J. Res. Dev. 39 (1995) 371
4. Rosenberg R., Edelstein D.C., Hu C.-K., and Rodbell K.P. Ann. Rev. Mater. Sci. 30 (2000) 229
5. Murarka S.P., and Hymes S.W. Crit. Rev. Solid State Mater. Sci. 20 (1995) 87
6. Mallikarjunan A., Sharma S., and Murarka S.P. Electrochem. Solid State Lett. 3 (2000) 437
7. Liu H.-D., Zhao Y.-P., Ramanath G., Murarka S.P., and Wang G.-C. Thin Solid Films 384 (2001) 151
8. Steinhogl W., Schindler G., Steinlesberger G., Traving M., and Engelhardt M. J. Appl. Phys. 97 (2005) 023706-1
9. Steinhogl W., Schindler G., and Engelhardt M. Semiconductor Intl. (2005) 34
10. Zhang W., Brongersma S.H., Clarysse T., Terzieva V., Rosseel E., Vandervorst W., and Maex K. J. Vac. Sci. Technol. B 22 (2004) 1830
11. Knorr D.B., and Tracy D.P. Mater. Chem. Phys. 41 (1995) 206
12. Wu W., Ernur D., Brongersma S.H., Van Hove M., and Maex K. Microelectron. Eng. 76 (2004) 190
13. Zhang W., Brongersma S.H., Heylen N., Beyer G., Vandervorst W., and Maex K. J. Electrochem. Soc. 152 (2005) C832
14. Steinhogl W., Steinlesberger G., Perrin M., Scheinbacher G., Schindler G., Traving M., and Engelhardt M. Microelectron. Eng. 82 (2005) 266
15. Steinbruchel C. Appl. Surf. Sci. 91 (1995) 139
16. Ohno K., Sato M., and Arita Y. Jpn. J. Appl. Phys. 28 (1989) L1070
17. Markert M., Bertz A., Gessner T., Ye Y., Zhao A., and Ma D. Microelectron. Eng. 50 (2000) 417
18. Lee S., and Kuo Y. J. Electrochem. Soc. 148 (2001) G524
19. Lee S., and Kuo Y. Thin Solid Films 457 (2004) 326
20. Schwartz G.C., and Schaible P.M. J. Electrochem. Soc. 130 (1983) 1777
21. Kuo Y., and Lee S. Vacuum 74 (2004) 473
22. Kulkarni N.S., and DeHoff R.T. J. Electrochem. Soc. 149 (2002) G620
23. Sesselmann W., and Chuang T.J. Surf. Sci. 176 (1986) 32
24. Haber J., Machej T., Ungier L., and Ziolkowski J. J. Solid State Chem. 25 (1978) 207
25. Battistoni C., Mattogno G., and Paparazzo E. Inorganica Chimica Acta 102 (1985) 1