Hydrogen bromide plasma-copper reaction in a new copper etching process

Thin Solid Films

Volumn 457, Issue 2, 2004, Pages 326-332

  Lee, Sangheon ^a   Kuo, Yue ^a  

^a Department of Electrical and Computer Engineering   (United States)

Author keywords

Copper etching; Dry etching of copper; Hydrogen bromide plasma; Plasma etching

Indexed keywords

ADDITION REACTIONS; BROMINE; CHLORINE; DISSOLUTION; MORPHOLOGY; PLASMA ETCHING; SOLUTIONS; THIN FILMS;

COPPER ETCHING; DRY ETCHING OF COPPER; HYDROGEN BROMIDE PLASMAS;

COPPER;

EID: 2342501840     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2003.10.011     Document Type: Article

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