Resistivity of copper films at thicknesses near the mean free path of electrons in copper

Electrochemical and Solid-State Letters

Volumn 3, Issue 9, 2000, Pages 437-438

  Mallikarjunan, A ^a   Sharma, S ^a   Murarka, S P ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; ARGON; COPPER; ELECTRIC CONDUCTIVITY MEASUREMENT; ELECTRON SCATTERING; GRAIN BOUNDARIES; MAGNETRON SPUTTERING; PASSIVATION; SEMICONDUCTING SILICON; SPUTTER DEPOSITION; THICKNESS MEASUREMENT; VACUUM APPLICATIONS;

COPPER FILM; DIFFUSE SCATTERING; FILM THICKNESS;

THIN FILMS;

EID: 0034274315     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1391172     Document Type: Article

References (7)

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6. C. Apblett, Ph.D Thesis, Rensselaer Polytechnic Institute, Troy, NY (1992).
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