Chlorine Plasma/Copper Reaction in a New Copper Dry Etching Process

Journal of the Electrochemical Society

Volumn 148, Issue 9, 2001, Pages

  Lee, Sangheon ^a   Kuo, Yue ^a  

^a Texas AandM University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0013321147     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1392324     Document Type: Article

References (13)

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