-
2
-
-
25844499765
-
Exploitation of optical interconnects in future server architectures
-
A. F. Benner, M. Ignatowski, J. A. Kash, D. M. Kuchta, and M. B. Ritter, "Exploitation of optical interconnects in future server architectures," IBM J. Res. Develop., vol. 49, no. 4-5, pp. 755-776, 2005.
-
(2005)
IBM J. Res. Develop.
, vol.49
, Issue.4-5
, pp. 755-776
-
-
Benner, A.F.1
Ignatowski, M.2
Kash, J.A.3
Kuchta, D.M.4
Ritter, M.B.5
-
3
-
-
4644336159
-
Parallel optical interconnects > 100 Gb/s
-
Sep.
-
L. A. Buckman-Windover, J. N. Simon, S. A. Rosenau, K. S. Giboney, G. M. Flower, L. W. Mirkarimi, A. Grot, B. Law, C.-K. Lin, A. Tandon, R. W. Gruhlke, H. Xia, G. Rankin, M. R. T. Tan, and D. W. Dolfi, "Parallel optical interconnects > 100 Gb/s," J. Lightw. Technol., vol. 22, no. 9, pp. 2055-2063, Sep. 2004.
-
(2004)
J. Lightw. Technol.
, vol.22
, Issue.9
, pp. 2055-2063
-
-
Buckman-Windover, L.A.1
Simon, J.N.2
Rosenau, S.A.3
Giboney, K.S.4
Flower, G.M.5
Mirkarimi, L.W.6
Grot, A.7
Law, B.8
Lin, C.-K.9
Tandon, A.10
Gruhlke, R.W.11
Xia, H.12
Rankin, G.13
Tan, M.R.T.14
Dolfi, D.W.15
-
4
-
-
4644247381
-
120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s testing station
-
Sep.
-
D. M. Kuchta, Y. H. Kwark, C. Schuster, C. Baks, C. Haymes, J. Schaub, P. Pepeljugoski, L. Shan, R. John, D. Kucharski, D. Rogers, M. Ritter, J. Jewell, L. A. Graham, K. Schrödinger, A. Schild, and H.-M. Rein, "120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s testing station," J. Lightw. Technol., vol. 22, no. 9, pp. 2200-2212, Sep. 2004.
-
(2004)
J. Lightw. Technol.
, vol.22
, Issue.9
, pp. 2200-2212
-
-
Kuchta, D.M.1
Kwark, Y.H.2
Schuster, C.3
Baks, C.4
Haymes, C.5
Schaub, J.6
Pepeljugoski, P.7
Shan, L.8
John, R.9
Kucharski, D.10
Rogers, D.11
Ritter, M.12
Jewell, J.13
Graham, L.A.14
Schrödinger, K.15
Schild, A.16
Rein, H.-M.17
-
5
-
-
24644492930
-
500-Gbps parallel WDM optical interconnect
-
Orlando, FL
-
B. E. Lemoff, M. E. Ali, G. Panotopoulos, E. de Groot, G. M. Flower, G. H. Rankin, A. J. Schmit, K. D. Djordjev, M. R. T. Tan, A. Tandon, W. Gong, R. P. Tella, B. Law, and D. W. Dolfi, "500-Gbps parallel WDM optical interconnect," presented at the 55th Electron. Compon. Technol. Conf., Orlando, FL, 2005.
-
(2005)
55th Electron. Compon. Technol. Conf.
-
-
Lemoff, B.E.1
Ali, M.E.2
Panotopoulos, G.3
De Groot, E.4
Flower, G.M.5
Rankin, G.H.6
Schmit, A.J.7
Djordjev, K.D.8
Tan, M.R.T.9
Tandon, A.10
Gong, W.11
Tella, R.P.12
Law, B.13
Dolfi, D.W.14
-
6
-
-
0000894702
-
Rationale and challenges for optical interconnects to electronic chips
-
Jun.
-
D. A. B. Miller, "Rationale and challenges for optical interconnects to electronic chips," Proc. IEEE, vol. 88, no. 6, pp. 728-749, Jun. 2000.
-
(2000)
Proc. IEEE
, vol.88
, Issue.6
, pp. 728-749
-
-
Miller, D.A.B.1
-
7
-
-
0000852922
-
Optical interconnects in systems
-
Jun.
-
A. F. J. Levi, "Optical interconnects in systems," Proc. IEEE, vol. 88, no. 6, pp. 750-757, Jun. 2000.
-
(2000)
Proc. IEEE
, vol.88
, Issue.6
, pp. 750-757
-
-
Levi, A.F.J.1
-
8
-
-
0037321730
-
Parallel optical interconnects for enterprise class server clusters: Needs and technology solutions
-
Feb.
-
J. Trezza, H. Hamster, J. Iamartino, H. Bagheri, and C. DeCustatis, "Parallel optical interconnects for enterprise class server clusters: Needs and technology solutions," IEEE Commun. Mag., vol. 41, no. 2, pp. S36-S42, Feb. 2003.
-
(2003)
IEEE Commun. Mag.
, vol.41
, Issue.2
-
-
Trezza, J.1
Hamster, H.2
Iamartino, J.3
Bagheri, H.4
DeCustatis, C.5
-
9
-
-
0242409707
-
Optical interconnects: Out of the box forever?
-
Mar.-Apr.
-
D. Huang, T. Sze, A. Landin, R. Lytel, and H. L. Davidson, "Optical interconnects: Out of the box forever?," IEEE J. Sel. Topics Quantum Electron., vol. 9, no. 2, pp. 614-623, Mar.-Apr. 2003.
-
(2003)
IEEE J. Sel. Topics Quantum Electron.
, vol.9
, Issue.2
, pp. 614-623
-
-
Huang, D.1
Sze, T.2
Landin, A.3
Lytel, R.4
Davidson, H.L.5
-
10
-
-
24644488796
-
Optical interconnect for ultra-short-reach applications
-
May
-
E. Mohammed, A. Alduino, T. Thomas, H. Braunisch, D. Lu, J. Heck, A. Liu, I. Young, B. Barnett, G. Vandentop, and R. Mooney, "Optical interconnect for ultra-short-reach applications," Intel Technol. J., vol. 8, no. 2, pp. 115-128, May 2004.
-
(2004)
Intel Technol. J.
, vol.8
, Issue.2
, pp. 115-128
-
-
Mohammed, E.1
Alduino, A.2
Thomas, T.3
Braunisch, H.4
Lu, D.5
Heck, J.6
Liu, A.7
Young, I.8
Barnett, B.9
Vandentop, G.10
Mooney, R.11
-
11
-
-
13444284483
-
On-chip optical interconnects
-
May
-
M. J. Kobrinsky, B. A. Block, J.-F. Zheng, B. C. Barnett, E. Mohammed, M. Reshotko, F. Robertson, S. List, I. Young, and K. Cadien, "On-chip optical interconnects," Intel Technol. J., vol. 8, no. 2, pp. 129-141, May 2004.
-
(2004)
Intel Technol. J.
, vol.8
, Issue.2
, pp. 129-141
-
-
Kobrinsky, M.J.1
Block, B.A.2
Zheng, J.-F.3
Barnett, B.C.4
Mohammed, E.5
Reshotko, M.6
Robertson, F.7
List, S.8
Young, I.9
Cadien, K.10
-
12
-
-
39749087255
-
Optical packet-switched interconnect for supercomputer applications
-
R. Hemenway, R. R. Grzybowski, C. Minkenberg, and R. Luijten, "Optical packet-switched interconnect for supercomputer applications," J. Opt. New., vol. 3, no. 12, pp. 900-913, 2004.
-
(2004)
J. Opt. New.
, vol.3
, Issue.12
, pp. 900-913
-
-
Hemenway, R.1
Grzybowski, R.R.2
Minkenberg, C.3
Luijten, R.4
-
13
-
-
33749839609
-
Challenges for the introduction of board-level optical interconnect technology into product development roadmaps
-
San Jose, CA, Jan. 21-26, Paper 6124-18
-
C. Berger, B. J. Offrein, and M. Schmatz, "Challenges for the introduction of board-level optical interconnect technology into product development roadmaps," presented at the Photonics West, San Jose, CA, Jan. 21-26, 2006, Paper 6124-18.
-
(2006)
Photonics West
-
-
Berger, C.1
Offrein, B.J.2
Schmatz, M.3
-
14
-
-
33845682879
-
A 10 Gb/s 5-tap-DFE/4-tap-FFE transceiver in 90 nm CMOS
-
San Francisco, CA, Feb.
-
M. Meghelli, S. Rylov, J. Bulzacchelli, W. Rhee, A. Rylyakov, H. Ainspan, B. Parker, M. Beakes, A. Chung, T. Beukema, P. Pepeljugoski, L. Shan, Y. Kwark, S. Gowda, and D. Friedman, "A 10 Gb/s 5-tap-DFE/4-tap-FFE transceiver in 90 nm CMOS," presented at the IEEE Int. Solid-State Circuits Conf., San Francisco, CA, Feb. 2006.
-
(2006)
IEEE Int. Solid-state Circuits Conf.
-
-
Meghelli, M.1
Rylov, S.2
Bulzacchelli, J.3
Rhee, W.4
Rylyakov, A.5
Ainspan, H.6
Parker, B.7
Beakes, M.8
Chung, A.9
Beukema, T.10
Pepeljugoski, P.11
Shan, L.12
Kwark, Y.13
Gowda, S.14
Friedman, D.15
-
15
-
-
22944471747
-
25-Gb/s electrical duobinary transmission over FR-4 backplanes
-
Jul.
-
A. Adamiecki, M. Duelk, and J. H. Sinsky, "25-Gb/s electrical duobinary transmission over FR-4 backplanes," Electron. Lett., vol. 41, no. 14, pp. 826-827, Jul. 2005.
-
(2005)
Electron. Lett.
, vol.41
, Issue.14
, pp. 826-827
-
-
Adamiecki, A.1
Duelk, M.2
Sinsky, J.H.3
-
16
-
-
84866404184
-
Developing a physical model for vias
-
Santa Clara, CA, Feb. 6-9, Paper 8-WA2
-
C. Schuster, Y. H. Kwark, G. Selli, and P. Muthana, "Developing a physical model for vias," presented at the DesignCon, Santa Clara, CA, Feb. 6-9, 2006, Paper 8-WA2.
-
(2006)
DesignCon
-
-
Schuster, C.1
Kwark, Y.H.2
Selli, G.3
Muthana, P.4
-
17
-
-
4644332256
-
Power comparison between high-speed electrical and optical interconnects for interchip communication
-
Sep.
-
H. Cho, P. Kapur, and K. C. Saraswat, "Power comparison between high-speed electrical and optical interconnects for interchip communication," J. Lightw. Technol., vol. 22, no. 9, pp. 2021-2033, Sep. 2004.
-
(2004)
J. Lightw. Technol.
, vol.22
, Issue.9
, pp. 2021-2033
-
-
Cho, H.1
Kapur, P.2
Saraswat, K.C.3
-
18
-
-
0141951976
-
SMT-compatible large-tolerance 'OptoBump' interface for interchip optical interconnections
-
May
-
Y. Ishii, S. Koike, Y. Arai, and Y. Ando, "SMT-compatible large-tolerance 'OptoBump' interface for interchip optical interconnections, " IEEE Trans. Adv. Packag., vol. 26, no. 2, pp. 122-127, May 2003.
-
(2003)
IEEE Trans. Adv. Packag.
, vol.26
, Issue.2
, pp. 122-127
-
-
Ishii, Y.1
Koike, S.2
Arai, Y.3
Ando, Y.4
-
19
-
-
4644226670
-
Board-level optical interconnection and signal distribution using embedded thin-film optoelectronic devices
-
Sep.
-
S.-Y. Cho, S.-W. Seo, N. M. Jokerst, and M. A. Brooke, "Board-level optical interconnection and signal distribution using embedded thin-film optoelectronic devices," J. Lightw. Technol., vol. 22, no. 9, pp. 2111-2118, Sep. 2004.
-
(2004)
J. Lightw. Technol.
, vol.22
, Issue.9
, pp. 2111-2118
-
-
Cho, S.-Y.1
Seo, S.-W.2
Jokerst, N.M.3
Brooke, M.A.4
-
20
-
-
12344306410
-
Characterization of parallel optical-interconnect waveguides integrated on a printed circuit board
-
G.-L. Bona, B. J. Offrein, U. Bapst, C. Berger, R. Beyeler, R. Budd, R. Dangel, L. Dellmann, and F. Horst, "Characterization of parallel optical-interconnect waveguides integrated on a printed circuit board," in Proc. SPIE Micro-optics, VCSELs, and Photonic Integration, 2004, vol. 5453, pp. 134-141.
-
(2004)
Proc. SPIE Micro-optics, VCSELs, and Photonic Integration
, vol.5453
, pp. 134-141
-
-
Bona, G.-L.1
Offrein, B.J.2
Bapst, U.3
Berger, C.4
Beyeler, R.5
Budd, R.6
Dangel, R.7
Dellmann, L.8
Horst, F.9
-
21
-
-
33745504951
-
New generation interconnection technology: Printer circuit boards with integrated optical layers
-
Garmisch-Partenkirchen, Germany, May 10-13
-
P. Demmer, R. Mödinger, J. Bauer, F. Ebling, H. Schröder, P. Beil, H. Albrecht, A. Beier, K. Pfeiffer, M. Franke, E. Griese, R. Reuber, and J. Kostelnik, "New generation interconnection technology: Printer circuit boards with integrated optical layers," presented at the 9th IEEE Workshop Signal Propagation on Interconnects, Garmisch-Partenkirchen, Germany, May 10-13, 2005.
-
(2005)
9th IEEE Workshop Signal Propagation on Interconnects
-
-
Demmer, P.1
Mödinger, R.2
Bauer, J.3
Ebling, F.4
Schröder, H.5
Beil, P.6
Albrecht, H.7
Beier, A.8
Pfeiffer, K.9
Franke, M.10
Griese, E.11
Reuber, R.12
Kostelnik, J.13
-
22
-
-
10744222687
-
Optoelectronic interconnection technology in the HOLMS system
-
Mar.-Apr.
-
P. Lukowicz, J. Jahns, R. Barbieri, P. Benabes, T. Bierhoff, A. Gauthier, M. Jarczynski, G. A. Russell, J. Schrage, W. Süllau, J. F. Snowdon, M. Wirz, and G. Tröster, "Optoelectronic interconnection technology in the HOLMS system," IEEE J. Sel. Topics Quantum Electron., vol. 9, no. 2, pp. 624-635, Mar.-Apr. 2003.
-
(2003)
IEEE J. Sel. Topics Quantum Electron.
, vol.9
, Issue.2
, pp. 624-635
-
-
Lukowicz, P.1
Jahns, J.2
Barbieri, R.3
Benabes, P.4
Bierhoff, T.5
Gauthier, A.6
Jarczynski, M.7
Russell, G.A.8
Schrage, J.9
Süllau, W.10
Snowdon, J.F.11
Wirz, M.12
Tröster, G.13
-
23
-
-
0242661523
-
Multichannel ultrathin silicon-on-sapphire optical interconnects
-
Mar.-Apr.
-
J. J. Liu, Z. Kalavjian, B. Riely, W. Chang, G. J. Simonis, A. Apsel, and A. Andreou, "Multichannel ultrathin silicon-on-sapphire optical interconnects," IEEE J. Sel. Topics Quantum Electron., vol. 9, no. 2, pp. 380-386, Mar.-Apr. 2003.
-
(2003)
IEEE J. Sel. Topics Quantum Electron.
, vol.9
, Issue.2
, pp. 380-386
-
-
Liu, J.J.1
Kalavjian, Z.2
Riely, B.3
Chang, W.4
Simonis, G.J.5
Apsel, A.6
Andreou, A.7
-
24
-
-
19944430299
-
A parallel optical interconnect link with on-chip optical access
-
Strasbourg, France, Apr.
-
R. Bockstaele, M. De Wilde, W. Meeus, O. Rits, H. Lambrecht, J. Van Campenhout, J. De Baets, P. Van Daele, E. van den Berg, M. Klemenc, S. Eitel, R. Annen, J. Van Koetsem, G. Widawski, B. Bareel, J. Goudeau, P. Le Moine, R. Fries, P. Straub, F. Marion, J. Routin, and R. Baets, "A parallel optical interconnect link with on-chip optical access," in Proc. SPIE Photonics Europe, Strasbourg, France, Apr. 2004. pp. 124-133.
-
(2004)
Proc. SPIE Photonics Europe
, pp. 124-133
-
-
Bockstaele, R.1
De Wilde, M.2
Meeus, W.3
Rits, O.4
Lambrecht, H.5
Van Campenhout, J.6
De Baets, J.7
Van Daele, P.8
Van Den Berg, E.9
Klemenc, M.10
Eitel, S.11
Annen, R.12
Van Koetsem, J.13
Widawski, G.14
Bareel, B.15
Goudeau, J.16
Le Moine, P.17
Fries, R.18
Straub, P.19
Marion, F.20
Routin, J.21
Baets, R.22
more..
-
25
-
-
2142722263
-
Stacked polymeric multimode waveguide arrays for two-dimensional optical interconnects
-
Mar.
-
J.-S. Kim and J.-J. Kim, "Stacked polymeric multimode waveguide arrays for two-dimensional optical interconnects," J. Lightw. Technol., vol. 22, no. 3, pp. 840-844, Mar. 2004.
-
(2004)
J. Lightw. Technol.
, vol.22
, Issue.3
, pp. 840-844
-
-
Kim, J.-S.1
Kim, J.-J.2
-
26
-
-
4644372764
-
Optical backplane system using waveguide-embedded PCBs and optical slots
-
Sep.
-
K. B. Yoon, I.-K. Cho, S. H. Ahn, M. Y. Jeong, D. J. Lee, Y. U. Heo, B. S. Rho, H.-H. Park, and B.-H. Rhee, "Optical backplane system using waveguide-embedded PCBs and optical slots," J. Lightw. Technol., vol. 22, no. 9, pp. 2119-2127, Sep. 2004.
-
(2004)
J. Lightw. Technol.
, vol.22
, Issue.9
, pp. 2119-2127
-
-
Yoon, K.B.1
Cho, I.-K.2
Ahn, S.H.3
Jeong, M.Y.4
Lee, D.J.5
Heo, Y.U.6
Rho, B.S.7
Park, H.-H.8
Rhee, B.-H.9
-
27
-
-
4644285402
-
PCB-compatible optical interconnection using 45 "-ended connection rods and via-holed waveguides
-
Sep.
-
B. S. Rho, S. Kang, H. S. Cho, H.-H. Park, S.-W. Ha, and B.-H. Rhee, "PCB-compatible optical interconnection using 45 "-ended connection rods and via-holed waveguides," J. Lightw. Technol., vol. 22, no. 9, pp. 2128-2134, Sep. 2004.
-
(2004)
J. Lightw. Technol.
, vol.22
, Issue.9
, pp. 2128-2134
-
-
Rho, B.S.1
Kang, S.2
Cho, H.S.3
Park, H.-H.4
Ha, S.-W.5
Rhee, B.-H.6
-
28
-
-
33144488771
-
Passively assembled optical interconnection system based on an optical printed-circuit board
-
Mar.
-
S. H. Hwang, M. H. Cho, S.-K. Kang, H.-H. Park, H. S. Cho, S.-H. Kim, K.-U. Shin, and S.-W. Ha, "Passively assembled optical interconnection system based on an optical printed-circuit board," IEEE Photon. Technol. Lett., vol. 18, no. 5, pp. 652-654, Mar. 2006.
-
(2006)
IEEE Photon. Technol. Lett.
, vol.18
, Issue.5
, pp. 652-654
-
-
Hwang, S.H.1
Cho, M.H.2
Kang, S.-K.3
Park, H.-H.4
Cho, H.S.5
Kim, S.-H.6
Shin, K.-U.7
Ha, S.-W.8
-
29
-
-
33749822026
-
Optical design of active interposer for high-speed chip level optical interconnects
-
Feb.
-
S. Hiramatsu and T. Mikawa, "Optical design of active interposer for high-speed chip level optical interconnects," J. Lightw. Technol., vol. 24, no. 2, pp. 927-934, Feb. 2006.
-
(2006)
J. Lightw. Technol.
, vol.24
, Issue.2
, pp. 927-934
-
-
Hiramatsu, S.1
Mikawa, T.2
-
30
-
-
0242493167
-
Design and test of an optoelectronic-VLSI chip with 540-element receiver-transmitter arrays using differential optical signaling
-
Mar.-Apr.
-
M. B. Venditti, E. Laprise, J. Faucher, P.-O. Laprise, J. E. A. Lugo, and D. V. Plant, "Design and test of an optoelectronic-VLSI chip with 540-element receiver-transmitter arrays using differential optical signaling," IEEE J. Sel. Topics Quantum Electron., vol. 9, no. 2, pp. 361-379, Mar.-Apr. 2003.
-
(2003)
IEEE J. Sel. Topics Quantum Electron.
, vol.9
, Issue.2
, pp. 361-379
-
-
Venditti, M.B.1
Laprise, E.2
Faucher, J.3
Laprise, P.-O.4
Lugo, J.E.A.5
Plant, D.V.6
-
31
-
-
28144445669
-
A 100 mW 4 × 10 Gb/s transceiver in 80-nm CMOS for high-density optical interconnects
-
San Francisco, CA, Feb.
-
C. Kromer, G. Sialm, C. Berger, T. Morf, M. Schmatz, F. Ellinger, D. Erni, G.-L. Bona, and H. Jäckel, "A 100 mW 4 × 10 Gb/s transceiver in 80-nm CMOS for high-density optical interconnects," in Proc. IEEE Int. Solid-State Circuits Conf., San Francisco, CA, Feb. 2005, pp. 334-336.
-
(2005)
Proc. IEEE Int. Solid-state Circuits Conf.
, pp. 334-336
-
-
Kromer, C.1
Sialm, G.2
Berger, C.3
Morf, T.4
Schmatz, M.5
Ellinger, F.6
Erni, D.7
Bona, G.-L.8
Jäckel, H.9
-
32
-
-
27644589535
-
1 V, 10 mW, 10 Gb/s CMOS optical receiver front-end
-
Long Beach, CA, Jun.
-
D. Guckenberger, J. D. Schaub, D. Kucharski, and K. T. Kornegay, "1 V, 10 mW, 10 Gb/s CMOS optical receiver front-end," presented at the IEEE RFIC Symp., Long Beach, CA, Jun. 2005.
-
(2005)
IEEE RFIC Symp.
-
-
Guckenberger, D.1
Schaub, J.D.2
Kucharski, D.3
Kornegay, K.T.4
-
33
-
-
0033889511
-
Advances in polymer integrated optics
-
Jan.-Feb.
-
L. Eldada and L. W. Shacklette, "Advances in polymer integrated optics," IEEE J. Sel. Topics Quantum Electron., vol. 6, no. 1, pp. 54-68, Jan.-Feb. 2000.
-
(2000)
IEEE J. Sel. Topics Quantum Electron.
, vol.6
, Issue.1
, pp. 54-68
-
-
Eldada, L.1
Shacklette, L.W.2
-
34
-
-
1442287418
-
Ultra-low-loss polymer waveguides
-
Jan.
-
A. Yeniay, R. Gao, K. Takayama, R. Gao, and A. F. Garito, "Ultra-low-loss polymer waveguides," J. Lightw. Technol., vol. 22, no. 1, pp. 154-158, Jan. 2004.
-
(2004)
J. Lightw. Technol.
, vol.22
, Issue.1
, pp. 154-158
-
-
Yeniay, A.1
Gao, R.2
Takayama, K.3
Gao, R.4
Garito, A.F.5
-
35
-
-
33845368356
-
Low loss and highly reliable polymer optical waveguides with perflu-orinated dopant-free core
-
Anaheim, CA, Mar. 5-10, Paper OWF2
-
Y. Kuwana, S. Takenobu, K. Takayama, S. Yokotsuka, and S. Kodama, "Low loss and highly reliable polymer optical waveguides with perflu-orinated dopant-free core," presented at the Opt. Fiber Commun. Conf., Anaheim, CA, Mar. 5-10, 2006, Paper OWF2.
-
(2006)
Opt. Fiber Commun. Conf.
-
-
Kuwana, Y.1
Takenobu, S.2
Takayama, K.3
Yokotsuka, S.4
Kodama, S.5
-
36
-
-
28344443542
-
45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects
-
Sep.
-
L. Wang, X. Wang, W. Jiang, J. Choi, H. Bi, and R. Chen, "45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects," Appl. Phys. Lett., vol. 87, no. 14, Sep. 2005, 3 p.
-
(2005)
Appl. Phys. Lett.
, vol.87
, Issue.14
-
-
Wang, L.1
Wang, X.2
Jiang, W.3
Choi, J.4
Bi, H.5
Chen, R.6
-
37
-
-
33845572327
-
Passive alignment of optical elements in a printed circuit board
-
San Diego, CA, Paper 371
-
T. Lamprecht, F. Horst, R. Dangel, R. Beyeler, N. Meier, L. Dellmann, M. Gmür, C. Berger, and B. J. Offrein, "Passive alignment of optical elements in a printed circuit board," presented at the 56th Electron. Compon. Technol. Conf., San Diego, CA, 2006, Paper 371.
-
(2006)
56th Electron. Compon. Technol. Conf.
-
-
Lamprecht, T.1
Horst, F.2
Dangel, R.3
Beyeler, R.4
Meier, N.5
Dellmann, L.6
Gmür, M.7
Berger, C.8
Offrein, B.J.9
-
38
-
-
25844527315
-
The evolution of build-up package technology and its design challenges
-
E. D. Blackshear, M. Cases, E. Klink, S. R. Engle, R. S. Malfatt, D. N. de Araujo, S. Oggioni, L. D. LaCroix, J. A. Wakil, G. G. Houghham, N. H. Pham, and D. J. Russell, "The evolution of build-up package technology and its design challenges," IBM J. Res. Develop., vol. 49, no. 4-5, pp. 641-661, 2005.
-
(2005)
IBM J. Res. Develop.
, vol.49
, Issue.4-5
, pp. 641-661
-
-
Blackshear, E.D.1
Cases, M.2
Klink, E.3
Engle, S.R.4
Malfatt, R.S.5
De Araujo, D.N.6
Oggioni, S.7
LaCroix, L.D.8
Wakil, J.A.9
Houghham, G.G.10
Pham, N.H.11
Russell, D.J.12
-
39
-
-
25844453501
-
Development of next-generation system-on package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
-
J. U. Knickerbocker, P. S. Andry, L. P. Buchwalter, A. Deutsch, R. R. Horton, K. A. Jenkins, Y. H. Kwark, G. McVicker, C. S. Patel, R. J. Polastre, C. Schuster, A. Sharma, S. M. Sri-Jayantha, C. W. Surovic, C. K. Tsang, B. C. Webb, S. L. Wright, S. R. McKnight, E. J. Sprogis, and B. Dang, "Development of next-generation system-on package (SOP) technology based on silicon carriers with fine-pitch chip interconnection," IBM J. Res. Develop., vol. 49, no. 4-5, pp. 725-753, 2005.
-
(2005)
IBM J. Res. Develop.
, vol.49
, Issue.4-5
, pp. 725-753
-
-
Knickerbocker, J.U.1
Andry, P.S.2
Buchwalter, L.P.3
Deutsch, A.4
Horton, R.R.5
Jenkins, K.A.6
Kwark, Y.H.7
McVicker, G.8
Patel, C.S.9
Polastre, R.J.10
Schuster, C.11
Sharma, A.12
Sri-Jayantha, S.M.13
Surovic, C.W.14
Tsang, C.K.15
Webb, B.C.16
Wright, S.L.17
McKnight, S.R.18
Sprogis, E.J.19
Dang, B.20
more..
-
40
-
-
4544258534
-
Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications
-
San Diego, CA
-
R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, and G.-L. Bona, "Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications," in IEEE/LEOS Summer Topical Meetings Tech. Dig., San Diego, CA, 2004, 2 p.
-
(2004)
IEEE/LEOS Summer Topical Meetings Tech. Dig.
-
-
Dangel, R.1
Bapst, U.2
Berger, C.3
Beyeler, R.4
Dellmann, L.5
Horst, F.6
Offrein, B.7
Bona, G.-L.8
-
41
-
-
33749863622
-
High-speed 985 nm bottom-emitting VCSEL arrays for chip-to-chip parallel optical interconnects
-
to be published
-
C. K. Lin, A. Tandon, K. D. Djordjev, S. Corzine, and M. R. T. Tan, "High-speed 985 nm bottom-emitting VCSEL arrays for chip-to-chip parallel optical interconnects," J. Lightw. Technol., to be published.
-
J. Lightw. Technol.
-
-
Lin, C.K.1
Tandon, A.2
Djordjev, K.D.3
Corzine, S.4
Tan, M.R.T.5
-
42
-
-
25844485405
-
A 20Gb/s VCSEL driver with pre-emphasis and regulated output impedance in 0.13 μm CMOS
-
San Francisco, CA, Feb.
-
D. Kucharski, Y. H. Kwark, D. M. Kuchta, K. T. Kornegay, M. R. T. Tan, C.-K. Lynn, and A. Tandon, "A 20Gb/s VCSEL driver with pre-emphasis and regulated output impedance in 0.13 μm CMOS," presented at the IEEE Int. Solid-State Circuits Conf., San Francisco, CA, Feb. 2005.
-
(2005)
IEEE Int. Solid-state Circuits Conf.
-
-
Kucharski, D.1
Kwark, Y.H.2
Kuchta, D.M.3
Kornegay, K.T.4
Tan, M.R.T.5
Lynn, C.-K.6
Tandon, A.7
-
43
-
-
24644478268
-
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
-
Orlando, FL
-
C. S. Patel, C. K. Tsang, C. Schuster, F. E. Doany, H. Nyikal, C. W. Baks, R. Budd, L. P. Buchwalter, P. S. Andry, D. F. Canaperi, D. C. Edelstein, R. Horton, J. U. Knickerbocker, T. Krywanczyk, Y. H. Kwark, K. T. Kornegay, J. H. Magerlein, J. Rosner, and E. Sprogis, "Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver," presented at the 55th Electron. Compon. Technol. Conf., Orlando, FL, 2005.
-
(2005)
55th Electron. Compon. Technol. Conf.
-
-
Patel, C.S.1
Tsang, C.K.2
Schuster, C.3
Doany, F.E.4
Nyikal, H.5
Baks, C.W.6
Budd, R.7
Buchwalter, L.P.8
Andry, P.S.9
Canaperi, D.F.10
Edelstein, D.C.11
Horton, R.12
Knickerbocker, J.U.13
Krywanczyk, T.14
Kwark, Y.H.15
Kornegay, K.T.16
Magerlein, J.H.17
Rosner, J.18
Sprogis, E.19
-
44
-
-
10444237976
-
Injection molded solder technology for Pb-free wafer bumping
-
Las Vegas, NV
-
P. A. Gruber, D. Y. Shih, L. Belanger, G. Brouillette, D. Danovitch, V. Oberson, M. Turgeon, and H. Kimura, "Injection molded solder technology for Pb-free wafer bumping," in Proc. 54th Electron. Compon. Technol. Conf., Las Vegas, NV, 2004, pp. 650-654.
-
(2004)
Proc. 54th Electron. Compon. Technol. Conf.
, pp. 650-654
-
-
Gruber, P.A.1
Shih, D.Y.2
Belanger, L.3
Brouillette, G.4
Danovitch, D.5
Oberson, V.6
Turgeon, M.7
Kimura, H.8
-
45
-
-
24644477141
-
Thermal-mechanical analysis of terabus high-speed optoelectronic package
-
Orlando, FL
-
S. Hegde, L. Shan, D. M. Kuchta, Y. H. Kwark, C. W. Baks, F. E. Doany, J. A. Kash, and J. M. Trewhella, "Thermal-mechanical analysis of terabus high-speed optoelectronic package," in Proc. 55th Electron. Compon. Technol. Conf., Orlando, FL, 2005, pp. 1854-1858.
-
(2005)
Proc. 55th Electron. Compon. Technol. Conf.
, pp. 1854-1858
-
-
Hegde, S.1
Shan, L.2
Kuchta, D.M.3
Kwark, Y.H.4
Baks, C.W.5
Doany, F.E.6
Kash, J.A.7
Trewhella, J.M.8
-
46
-
-
4544309118
-
Measurement of optical dispersion in multimode polymer waveguides
-
San Diego, CA
-
F. E. Doany, P. K. Pepeljugoski, A. C. Lehman, J. A. Kash, and R. Dangel, "Measurement of optical dispersion in multimode polymer waveguides," in IEEE/LEOS Summer Topical Meetings Tech. Dig., San Diego, CA, 2004, 2 p.
-
(2004)
IEEE/LEOS Summer Topical Meetings Tech. Dig.
-
-
Doany, F.E.1
Pepeljugoski, P.K.2
Lehman, A.C.3
Kash, J.A.4
Dangel, R.5
-
47
-
-
17444379646
-
On-chip crosstalk mitigation for densely packed differential striplines using via fence enclosures
-
Mar.
-
D. Guckenberger, C. Schuster, Y. H. Kwark, and K. Kornegay, "On-chip crosstalk mitigation for densely packed differential striplines using via fence enclosures," Electron. Lett., vol. 41, no. 7, pp. 412-414, Mar. 2005.
-
(2005)
Electron. Lett.
, vol.41
, Issue.7
, pp. 412-414
-
-
Guckenberger, D.1
Schuster, C.2
Kwark, Y.H.3
Kornegay, K.4
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