New generation interconnection technology: Printed circuit boards with integrated optical layers

Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005

Volumn 2005, Issue , 2005, Pages 213-216

  Demmer, P ^a   Modinger R ^b   Bauer, J ^c   Ebling, F ^c   Schroder H ^c   Beil, P ^d   Albrecht, H ^e   Beier, A ^e   Pfeiffer, K ^f   Franke, M ^a   Griese, E ^g   Reuber, M ^g   Kostelnik, J ^h  

^a SIEMENS AG   (Germany)

^b Erni Elektroapparate GmbH   (Germany)

^c FRAUNHOFER IZM   (Germany)

^d Ilfa Feinstleitertechnik GmbH   (Germany)

^e INFINEON TECHNOLOGIES AG   (Germany)

^f MICRO RESIST TECHNOLOGY GMBH   (Germany)

^g UNIVERSITY OF SIEGEN   (Germany)

^h Wurth Elektronik GmbH and Co KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COUPLINGS; ELECTROOPTICAL DEVICES; INTEGRATED OPTICS; OPTICAL INTERCONNECTS; OPTICAL WAVEGUIDES; PHOTOLITHOGRAPHY; PRINTED CIRCUIT BOARDS; THERMAL CONDUCTIVITY;

ELECTRICAL INTERCONNECTS; LAMINATION; NEW GENERATION INTERCONNECTION TECHNOLOGY (NEGIT); OPTICAL LAYERS; WAVEGUIDE TECHNOLOGY;

INTERCONNECTION NETWORKS;

EID: 33745504951     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SPI.2005.1500948     Document Type: Conference Paper

References (9)

1. J. Bauer, R Ebling, H. Schröder, A. Beier, P. Beil, P. Demmer, M. Franke, E. Griese, M. Reuber, J. Kostelnik, R. Mödinger, K. Pfeiffer: "Leiterplatten mit innenliegender Optolage -Wellenleitertechnologie und Koppelkonzept," Proc. ITG-Workshop "Photonische Aufbauund Verbindungstechnik", Berlin/Germany, May 2005.
2. C. Berger, M. A. Kossel, C. Menolfi, T. Morf, T. Toifi, M. L. Schmatz: "High-density interconnects within lage-scale Systems," SPIE-Proceedings, Vol. 4242, pp. 222-235, 2002.
3. E. Griese, D. Krabe, E. Strake: "Electrical-optical printed circuit boards: Technology - Design - Modeling," H. Grabinski (Ed.): Interconnects in VLSI Designs, pp. 221-236, Kluwer Academic Publishers, Boston (USA), 2000.
4. E. Griese, A. Himmler, K. Klimke, A. Koske, J.-R. Kropp, S. Lehmacher, A. Neyer, W. Süllau: "Self-aligned coupling of optical transmitter and receiver modules to board-integrated multimode waveguides," M. K. Taghizadeh, H. Thienpont, G. E. Jabbour (Eds.): Micro- and Nanooptics for Optical Interconnection and Information Processing, Proceedings of SPIE, Vol. 4455, pp. 243-250, 2001.
5. A. F. J. Levi: "Optical Interconnects in Systems," Proceedings of the IEEE, Vol. 88, pp. 750-757, 2000.
6. B. Lunitz, J. Guttmann, H.-P. Huber, J. Moisel, M. Rode: "Experimental demonstration of 2.5 Gbps transmission with 1 m polymer optical backplane," Electronics Letters. Vol. 37, No. 17, p. 1079, September 2001.
7. H. Schröder, J. Bauer, F. Ebling, W. Scheel: "Polymer optical interconnects for PCB," Proc. Polytronic 2001, pp. 337-343, 2001.
8. H. Schröder, J. Bauer, F. Ebling, M. Franke, T. Happel, J. Kostelnik: "New optical coupling element for 90 degree waveguide coupling in electrical-optical circuit boards (EOCB)," Proc. Micro Optics Conference, Jena/Germany, 2004.
9. Semiconductor Industry Association: International Technology Roadmap for Semiconductors, 2004 Update.