A parallel optical interconnect link with on-chip optical access

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5453, Issue , 2004, Pages 124-133

  Bockstaele, Ronny ^a   De Wilde, Michiel ^a   Meeus, Wim ^a   Rits, Olivier ^a   Lambrecht, Hannes ^a   Van Campenhout, Jan ^a   De Baets, Johan ^a   Van Daele, Peter ^a   Van Den Berg, Eric ^b   Klemenc, Michaela ^c   Eitel, Sven ^d   Annen, Richard ^e   Van Koetsem, Jan ^f   Widawski, Gilles ^g   Goudeau, Jacques ^g   Bareel, Baudouin ^h   Le Moine, Patrick ⁱ   Fries, Reto ^j   Straub, Peter ^j   Marion, François ^k   Routin, Julien ^k   Baets, Roel ^a   more..

^a GHENT UNIVERSITY   (Belgium)

^b LUCENT TECHNOLOGIES   (United States)

^c Bookham Inc   (Switzerland)

^d Albis Optoelectronics AG   (Switzerland)

^e Helix AG   (Switzerland)

^f FCI's Hertogenbosch ^*  (Netherlands)

^g Nexans France   (France)

^h Nexans Cabling Systems   (Belgium)

ⁱ RCI SA   (France)

^j PPC Electronics AG   (Switzerland)

^k CEA GRENOBLE   (France)

more..

Author keywords

Parallel optical interconnects

Indexed keywords

BANDWIDTH; COMPUTER SIMULATION; DATA TRANSFER; OPTICAL COMMUNICATION; OPTICAL FIBERS; OPTOELECTRONIC DEVICES; TELECOMMUNICATION LINKS;

DATA DENSITY; ON-CHIP OPTICAL ACCESS; OPTICAL PATHWAYS; PARALLEL OPTICAL INTERCONNECTS;

OPTICAL INTERCONNECTS;

EID: 19944430299     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.545490     Document Type: Conference Paper

References (27)

1. D. Miller and H. Ozaktas, "Limit to the bit-rate capacity of electrical interconnects from the aspect ratio of the system architecture, " Journal of Parallel and Distributed Computing, vol. 41, no. 1, pp. 42-52, Feb. 1997.
2. J. Mitchell and B. Das: "A High Channel-Density, Ultra-High Bandwidth Reference Backplane Designed and Manufactured for 10-Gbps NRZ Serial Signaling", DesignCon 2004 conference, Santa Clare, USA.
3. D. Miller, "Rationale and challenges for optical interconnects to electronic chips," Proc. of IEEE, vol. 88, no. 6, pp. 728-749, June 2000.
4. N. Savage, "Linking with light," IEEE Spectrum, vol. 39, no. 8, pp. 32-36, Aug. 2002.
5. Venditti, M.B. Laprise, E. Faucher, J. Laprise, P.-O. Lugo, J.E.A. Plant, D.V.: "Design and test of an optoelectronic-VLSI chip with 540-element receiver-transmitter arrays using differential optical signaling", IEEE STQE, Vol 9, no2 (march 2003), pp 361- 379
6. Cook, C. Cunningham, J.E. Hargrove, A. Ger, G.G. Goossen, K.W. Jan,W.Y. Kim, H.H. Krause, R. Manges, M. Morrissey, M. Perinpanayagam, M. Persaud, A. Shevchuk, G.J. Sinyansky, V. Krishnamoorthy, A.V.: "A 36-channel parallel optical interconnect module based on optoelectronics-on-VLSI technology", IEEE JSTQE, Vol 9, no2 (March 2003), pp 387-399
7. Brunfaut, M.; Meeus, W.; Dambre, J.; Bockstaele, R.; Van Campenhout, J.; Melchior, H.; Hall, J.; Neyer, A.; Heremans, P.; Van Koetsem, J.; King, R.; Thienpont, H.; Vanwassenhove, L.; Baets, R.; "Demonstrating POF based optoelectronic interconnect in a multi-FPGA prototype system", 27th European Conference on Optical Communication, 2001. ECOC '01. ,Volume: 3 , 30 Sept.-4 Oct. 2001 Pages:298 - 299 vol.3
8. For more information on the IO project, see http://io.intec.ugent.be
9. Drogemuller, K.; Kuhl, D.; Blank, J.; Ehlert, M.; Kracker, T.; Hohn, J.; Klix, D.; Plickert, V.; Melchior, L.; Schmale, I.; Hildebrandt, P.; Heinemann, M.; Schiefelbein, F.P.; Leininger, L.; Wolf, H.-D.; Wipiejewski, T.; Ebberg, A.: "Current progress of advanced high speed parallel optical links for computer clusters and switching systems", 50th Electronic Components and Technology Conference, 2000. Pages: 1227 - 1235
10. For more information on parallel optical interconnect modules can be found at http://www.paralleloptics.org
11. Berger, C. Beyeler, R. Bona, G.-L. Dangel, R. Dellmann, L. Dill, P. Horst, F. Kossel, M.A. Menolli, C. Morf, T. Oflrein, B. Schmatz, M.L. Toifl, T. Weiss, J. : "Optical links for printed circuit boards", 16th Annual Meeting of the IEEE Lasers and Electro-Optics Society, 2003, page(s): 61 - 62
12. Griese, E.: "A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems", IEEE Transactions on Advanced Packaging, Volume: 24 , Issue: 3 , Aug. 2001, pages: 375 - 383
13. A. V. Krishnamoorthy, K.W. Goossen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, and L. A. D'Asaro, "16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit," IEEE Photon. Technol. Letters, vol. 12, pp. 1073-75, Aug. 2000.
14. Satake, T.; Arikawa, T.; Blubaugh, P.W.; Parsons, C.; Uchida, T.K. : "MT multifiber connectors and new applications", Proceedings 44th Electronic Components and Technology Conference, 1994, pages:994 - 999
15. R. Viswanath, V. Wakharkar, A. Watwe and V. Lebonheur,: "Thermal Performance Challenges from Silicon to Systems", Intel Technology Journal, Q3, 2000.
16. Eitel S, Fancey SJ, Gauggel HP, et al.: "Highly uniform vertical-cavity surface-emitting lasers integrated with microlens arrays", IEEE PHOTONIC TECH L 12 (5): 459-461 MAY 2000
17. Blaser, M.; Melchior, H.; "High performance monolithically integrated InP photoreceivers", Sixth International Conference on Indium Phosphide and Related Materials, 1994 , 27-31 March 1994, Pages:239 - 242
18. H. Zimmermann, T. Heide, A. Ghazi, "Monolithic high-speed CMOS-photoreceiver", IEEE Photon. Technol. Lett, Vol. 11, Feb. 1999, pp 254-256.
19. Rooman, C.; Kuijk, M.; Windisch, R.; Vounckx, R.; Borghs, G.; Plichta, A.; Brinkmann, M.; Gerstner, K.; Strack, R.; Van Daele, P.; Woittiez, W.; Baets, R.; Heremans, P.; "Inter-chip optical interconnects using imaging fiber bundles and integrated CMOS detectors" 27th European Conference on Optical Communication, 2001. ECOC '01., Volume: 3 , 30 Sept.-4 Oct. 2001, Pages:296 - 297 vol.3
20. Tissot JL, Marion F: "Collective flip-chip technology for infrared focal plane arrays", SENSOR MATER 12 (7): 389-396 2000
21. C.P. Wong "Polymers for encapsulation: Materials Processes and Reliability", Chip Scale Review, March 98. 1998, pages 30-37.
22. L. M. Higgins : "Hermetic and Optoelectronic Packaging Concepts Using Multiplayer and Active Polymer Systems", Advancing Microelectronics - July/August 2003, page 6-10
23. Koike, Y. Ishigure, T. : "Progress of low-loss GI polymer optical fiber from visible to 1.5-μm wavelength", 23rd European Conference on Optical Communications (ECOC), Sept 1997, Edinburgh UK, Volume 1, page 59-62
24. G. Widawski, J. Fournier, J. Goudeau, B. Bareel, P. Zamzow : "Cable designs for plastic optical fibre applications", POF2002, Japan
25. Grimes, G.J. Markush, J.P.C. Yiu-Man Wong Anthony, P.J. Holland, B. Priest, E.G. Sherman, C.J. Peck, S.R. Muehlner, D.J. Faudskar, C.C. Nyquist, J.S. Helton, J.S. Lepthian, C.A. Sonnier, G.L. Gates, J.V. Honea, W.K. Bortolini, J.R. : "Photonic packaging using laser/receiver arrays and flexible optical circuits", IEEE Transactions on: Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, Nov. 1997, pages 409-415
26. De Wilde, M.; Rits, O.; Bockstaele, R.; Baets, R.; Van Campenhout, J. Design Methodology Development for VCSEL-based Guided-Wave Optical Interconnects. Proceedings of the 7th IEEE Workshop on Signal Propagation on Interconnects. IEEE. 2003. pp. 137-138
27. De Wilde, M.; Rits, O.; Bockstaele, R.; Van Campenhout, J.; Baets, R. A circuit-level simulation approach to analyse system level behaviour of VCSEL-based optical interconnects. VCSELs and Optical Interconnects. Proceedings of SPIE. Vol. 4942. 2003. pp. 247-257