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Volumn 46, Issue 6, 2005, Pages 1295-1300

Intermetallic compound formation and growth kinetics in flip chip joints using Sn-3.0Ag-0.5Cu solder and Ni-P under bump metallurgy

(2) Kim, Dae Gon a Jung, Seung Boo a

a Sungkyunkwan University (South Korea)

Author keywords

Electroless nickel; Flip chip; Interfacial reaction; Reaction diffusion; Sn 3.0Ag 0.5Cu

Indexed keywords

ELECTROLESS NICKEL; FLIP CHIP; INTERFACIAL REACTION; REACTION DIFFUSION; SN-3.0AG-0.5CU;

ACTIVATION ENERGY; FLIP CHIP DEVICES; GROWTH KINETICS; INTERMETALLICS; METALLIZING; MICROSTRUCTURE; NICKEL; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS;

SOLDERED JOINTS;

EID: 23744476535 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.46.1295 Document Type: Article

Times cited : (8)

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