Shape prediction and residual stress evaluation of BGA and flip chip solder joints

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 181-186

  Sakai, Hidehisa ^a   Yamaoka, Nobuyoshi ^a   Ujiie, Kazuyuki ^a   Motegi, Masanori ^a   Shiratori, Masaki ^a   Yu, Qiang ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MORPHOLOGY; RESIDUAL STRESSES; SOLIDIFICATION; STATISTICAL METHODS; STRESS ANALYSIS; SURFACE TENSION;

BALL GRID ARRAY; SHAPE PREDICTION; SOFTWARE PACKAGE SURFACE EVOLVER; SOLDER SOLIDIFICATION PROCESS;

SOLDERED JOINTS;

EID: 0033694472     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)