Simulative analysis on factors influencing solder joint bridging of fine pitch devices

Journal of Electronic Packaging

Volumn 126, Issue 1, 2004, Pages 22-25

  Yu, Li Ming ^a   Sur, Bang Man ^a   Pyo, Kim Young ^a   Qing, Wang Chun ^b   Lei, Zhang ^b  

^a Chosun University   (South Korea)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DENSITY (SPECIFIC GRAVITY); ELECTRONICS PACKAGING; FUNCTIONS; LAGRANGE MULTIPLIERS; MATHEMATICAL MODELS; RELIABILITY; SURFACE TENSION;

AREA; COORDINATES; FREE SURFACES; GEOMETRIC PARAMETERS;

SOLDERED JOINTS;

EID: 8744314685     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1646421     Document Type: Article

References (7)

1. Gao, Y. X., Fan, H., and Xiao, Z., 2000, "A Thermodynamics Model for Solder Profile Evolution," Acta Mater., 48, pp. 863-874.
2. Conway, P. P., Kalantary, M. R., and Williams, D. J., 1996, "Experimental Investigation of the Formation of Surface Mount Solder Joints," ASME J. Electron. Packag., 118(4), pp. 223-228.
3. Heinrich, S. M., and Lee, P. S., 1997, "Solder Geometry Prediction in Electronic Packaging: An Overview," Advances in Electronic Packaging, 19(2), pp. 1371-1376.
4. Brake, K. A., 1998, "Surface Evolver Manual," Version 2.10, The Geometry Center, University of Minnesota, Minneapolis.
5. Wang, G. Z., Chen, Z. N., and Wang, C. Q., 1998, "Computer Simulation of Three Dimensional Castellated Solder Joint Geometry in Surface Mount Technology," Modell. Simul. Mater. Sci. Eng., 6, pp. 557-567.
6. Zhao, X. J., and Wang, C. Q., 2000, "An Integrated System for Prediction and Analysis of Solder Interconnection Shapes," IEEE Transaction on Electronics Packaging Manufacturing, 23(2), pp. 87-91.
7. Li, M. Y., Wang, C. Q., and Zhang, L., 2001, "Solder Bridge Mechanism in Surface Mount Technology," Prog. Nat. Sci., 11(3), pp. 221-225.