Solder joint formation simulation and finite element analysis

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 436-443

  Mui, Gary K ^a   Wu, Xiaohua ^a   Hu, Kai X ^a   Yeh, Chao Pin ^a   Wyatt, Karl ^a   Steger, Jim ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; NUMERICAL METHODS; SOLIDIFICATION; STRESS ANALYSIS; SURFACE MOUNT TECHNOLOGY; THERMAL STRESS;

BOND PAD SIZE;

SOLDERED JOINTS;

EID: 0030713753     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)