SuperCSP™

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 2, 2000, Pages 215-219

  Kawahara, Toshimi ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

Encapsulation technology; Reliability; Supercsp

Indexed keywords

BOND STRENGTH (MATERIALS); COPPER; ELECTRONICS PACKAGING; ENCAPSULATION; INTEGRATED CIRCUIT MANUFACTURE; METALLIC FILMS; POLYIMIDES; SILICON WAFERS; SOLDERING ALLOYS; SPUTTERING; STRESSES;

ENCAPSULANT; ENCAPSULATION TECHNOLOGY; SOLDER BALL; SUPER CHIP SIZED PACKAGE; WAFER LEVEL PACKAGING TECHNOLOGY;

MICROPROCESSOR CHIPS;

EID: 0033715475     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.846637     Document Type: Article

References (7)

1. H. Matsuki, Y. Shinma, K. Nagashige, Y. Hamanaka, N. Fukasawsa, M. Morioka, M. Onodera, T. Uno, and T. Kawahara, "SuperCSP: A BGA type real chip size package using a new encapsulation method," in Proc. Pan Pacific Microelectron. Symp., 1998, pp. 415-420.
2. T. Kawahara, "New sealing technology enables real chip-sized packages, "Asia Electron. Ind., vol. 3, no. 11, pp. 50-55, 1998.
3. Y Yoneda, "SuperCSP," in Proc. Tech. STS, 1998, pp. 93-98.
4. T. Kawahara et al., "Ball grid array type package by using of new encapsulation method," in proc. 1EPS, 1995, pp. 577-587.
5. T. Kawahara, "Micro BGA-T," in Proc. Tech. STS, 1995, pp. 333.
6. H. Yang, A. Earson, S. Barrett, and P. Elenius, "Reliability evaluation of ultra CSP packages," in Proc. SMTA Emerging Technologies Conf., 1998.
7. S. S. Manson, Thermal Stress and Low Cycle Fatigue. New York: McGraw Hill, 1996.