Effect of solder joint geometry on the predicted fatigue life of BGA solder joints

Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1996, Pages 187-191

  Holub, Ira R ^a   Pitarresi, James M ^a   Singler, Timothy J ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; SERVICE LIFE;

BALL GRID ARRAY (BGA); FATIGUE LIFE; SOLDER JOINT GEOMETRY;

SOLDERED JOINTS;

EID: 0029696440     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)