Shape prediction of solder bump joint by surface tension analysis and fatigue strength evaluation

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1407-1412

  Kitano, Makoto ^a   Honda, Michiharu ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001653023     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)

1. Rayleigh, L., 1882, "Intensity of Light Reflected from Water and Mercury": Collected Scientific Papers IV, pp. 13.
2. Wassink, R. J., 1986, "Soldering in electronics", Chapter 2.
3. Heinrich, S. M., 1994, "Prediction of Solder Joint Geometry", Chapter 5 of "Mechanics of Solder Alloy Interconnects", Frear, D. et al (eds.), Van Nostrand Reinhold, pp. 158-198.
4. Heinrich, S. M., et al, 1996, "Prediction of Solder Joint Geometries in Array-Type Interconnects", Journal of Electronic Packaging, ASME, Vol.118, No.3, pp. 114-121.
5. Heinrich, S. M., et al, 1996, "Improved Yield and Performance of Ball-Grid Array Packages: Design and Processing Guidelines for Uniform and Nonuniform Arrays", Transactions on Components, Packaging and Manufacturing Technology - Part B, IEEE, Vol.19, No. 2, pp. 310-319.
6. Borgesen, P., et al, 1993, "Mechanical Design Considerations for Area Array Solder Joints", Transactions on Components, Hybrids and Manufacturing Technology, IEEE, Vol.16, No.3, pp. 272-283.
7. Yost, B., et al, 1993, "Shape of a Nonaxisymmetric Liquid Solder Drop Constrained by Parallel Plates", Transactions on Components, Hybrids and Manufacturing Technology, IEEE, Vol.16, No.5, pp. 523-526.
8. LaPlace, P. S., 1805, "Theory of Capillary Attraction".
9. Howie, F. H., 1982, "The Surface Tension of Tin-Lead Alloys in Contact with Fluxes", Journal of Material Science, Vol.17, No.5, pp. 1434.
10. For example, Hwang, J. S., 1991, "Solder Paste in Electronics Packaging", Chapter 3.
11. Flint, O., 1965, "Surface Tension of Liquid Metals", Journal of Nuclear Materials, No.16, pp. 233.
12. Kitano, M. et al, 1989, "Thermal Fatigue Strength Estimation of Solder Joints of Surface Mount IC Packages", Soldering and Surface Mount Technology, No.2, pp. 4-8.
13. Kitano, M. et al, 1992, "A New Evaluation Method for Thermal Fatigue Strength of Solder Joint", Advanced in Electronic Packaging 1992, ASME, pp. 301-308.