Placement and routing for 3-D system-on-package designs

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 3, 2006, Pages 644-657

  Minz, Jacob Rajkumar ^a   Wong, Eric ^a   Pathak, Mohit ^a   Lim, Sung Kyu ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Crosstalk; Mixed signal CAD; Placement and routing; Power supply noise; System on package (SOP); Thermal distribution; Three dimensional (3 D) packaging

Indexed keywords

ALGORITHMS; CROSSTALK; SIGNAL SYSTEMS; SPURIOUS SIGNAL NOISE; SYSTEMS ANALYSIS; TEMPERATURE DISTRIBUTION;

MIXED SIGNAL SYSTEM; SYSTEM-ON-PACKAGE (SOP); THREE-DIMENSIONAL (3-D) PACKAGING;

CHIP SCALE PACKAGES;

EID: 33748314386     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.880441     Document Type: Article

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