Module placement for power supply noise and wire congestion avoidance in 3D packaging

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2004, Pages 123-126

  Minz, Jacob ^a   Lim, Sung Kyu ^a   Choi, Jinwoo ^a   Swaminathan, Madhavan ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONGESTION AVOIDANCE; POWER SUPPLY NOISE; SIMULTANEOUS SWITCHING NOISE (SSN); THREE DIMENSIONAL (3D) PACKAGING;

ALGORITHMS; CAPACITANCE; COMPUTER AIDED DESIGN; COMPUTER SIMULATION; ELECTRIC POWER SUPPLIES TO APPARATUS; SPURIOUS SIGNAL NOISE; SWITCHING; THREE DIMENSIONAL;

ELECTRONICS PACKAGING;

EID: 15944372883     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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