The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 2, 2004, Pages 250-267

  Tummala, Rao R ^a   Swaminathan, Madhavan ^a   Tentzeris, Manos M ^a   Laskar, Joy ^a   Chang, Gee Kung ^a   Sitaraman, Suresh ^a   Keezer, David ^a   Guidotti, Daniel ^a   Huang, Zhaoran ^a   Lim, Kyutae ^a   Wan, Lixi ^a   Bhattacharya, Swapan K ^a   Sundaram, Venkatesh ^a   Liu, Fuhan ^a   Raj, P Markondeya ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNAS; CMOS INTEGRATED CIRCUITS; DIGITAL INTEGRATED CIRCUITS; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED OPTOELECTRONICS; INTELLIGENT NETWORKS; MILLIMETER WAVE DEVICES; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; SIGNAL INTERFERENCE; THIN FILM CIRCUITS;

EMBEDDED COMPONENTS; EMBEDDED PASSIVES; EMBEDDED WAVEGUIDES; MICROVIA; MIXED SIGNAL DESIGN; SIGNAL INTEGRITY;

CHIP SCALE PACKAGES;

EID: 4544346240     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.830353     Document Type: Article

References (63)

1. R. R. Tummala et al., Ceramic Packaging Technology, Microelectronics Packaging Handbook. New York: Van Nostrand, 1988.
2. Y. Tsukada, S. Tsuchida, and Y. Mashimoto, "Surface laminar circuit packaging," in Proc. 42nd Electronic Components and Technology Conference, 1992, pp. 22-7.
3. Y. Yano, T. Sugiyama, S. Ishihara, Y. Fukui, H. Juso, K. Miyata, Y. Sota, and K. Fhjita, "Three dimensional very thin stacked packaging technology for SiP," in Proc. 52nd Electronic Components and Technology Conference, 2002.
4. R. Tummala, "SOP: Microelectronic systems packaging technology for the 21st century," Adv. Microelectron., vol. 26, no. 3, pp. 29-37, May-June 1999.
5. R. Tummala, G. White, V. Sundaram, and S. Bhattacharya, "SOP: The microelectronics for the 21st century with integral passive integration," Adv. Microelectron., vol. 27, pp. 13-19, 2000.
6. R. Tummala and V. Madisetti, "System on chip or system on package," IEEE Design Test Comput., vol. 16, no. 2, pp. 48-56, Apr.-June 1999.
7. R. Tummala and J. Laskar, "Gigabit wireless: System-on-a-package technology," Proc. IEEE, vol. 92, pp. 376-387, Feb. 2004.
8. R. R. Tummala, "Low Cost and Highly Integrated Systems Packaging," Proposal for NSF Engineering Research Center, 1993.
9. K. Lim, M. F. Davis, M. Maeng, S. Pinel, L. Wan, L. Laskar, V. Sundaram, G. White, M. Swaminathan, and R. Tummala, "Intelligent network communicator: Highly integrated system-on-package (SOP) testbed for RF/digital/opto applications," in Proc. 2003 Electronic Components and Technology Conference, pp. 27-30.
10. H. P. Hofstee, "Future microprocessors and off-chip SOP interconnect," IEEE Trans. Adv. Packag., vol. 27, pp. 65-69, May 2004.
11. J. Choi and M. Swaminathan, "Modeling of power supply noise in large chips using the finite difference time domain method," IEEE Trans. Electromagn. Compat., vol. 45, July 2003, submitted for publication.
12. International Technology Roadmap on Semiconductors (ITRS). [Online]. Available: www.src.org
13. J. H. Kim and M. Swaminathan, "Modeling of multilayered power distribution planes using transmis-sion matrix method," IEEE Trans. Comp, Packag. Manufact. Technol. - Adv. Packag., vol. 25, no. 2, pp. 189-199, May 2002.
14. S. H. Min and M. Swaminathan, "Construction of broadband passive macromodels from frequency data for simulation of distributed interconnect networks," in Proc. Int. Symposium on Electromagnetic Compatibility, Zurich, Switzerland, Feb. 2003.
15. "International Technology Roadmap for Semiconductors, 2003 Edition "Assembly and Packaging"," Semiconductor Industry Association, Chapter, Table 92a, 92b, 96, 100, 2004.
16. V. Sundaram, R. Tummala, F. Liu, P. Kohl, J. Li, S. A. Bidstrup-Allen, and Y. Fukuoka, "Next generation microvia and global interconnect technologies for SOP," IEEE Trans. Adv. Packag., 2004, submitted for publication.
17. M. Asai, "New packaging substrate technology IBSS (interpenetrating polymer network build up structure system)," in Proc. Electronic Packaging Materials Science IX. Symposium, 1997, pp. 117-24.
18. K. Segawa, "Build-up PWB with laser-processed via holes "VIL"," Proc. SPIE - The International Society for Optical Engineering, vol. 3582, pp. 419-24, 1999.
19. D. Andoh, Y. Tomita, T. Nakamura, and F. Echigo, "The progress of the ALIVH substrate," in Proc. 52nd Electronic Components and Technology Conference, 2002, pp. 1419-24.
20. T. Kariya and R. Enomoto, "Development of multilayer printed wring board with stacked via holes using single step laminating process," in Proc. 3rd IEMT/IMC Symposium, 1999, pp. 194-199.
21. F. Liu, G. White, V. Sundaram, A. O. Aggarwal, S. M. Hosseini, D. Sutter, and R. Tummala, "A novel technology for stacking microvias on printed circuit boards," in Proc. 53rd IEEE ECTC, May 2003, pp. 1134-1139.
22. N. Kumbhat, P. M. Raj, R. Pucha, S. Sitaraman, V. Sundaram, S. Bhattacharya, R. Tummala, S. Hayes, and S. Atmur, "Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly," in Proc. Electronic Components and Packaging Technology Conference, Las Vegas, NV, 2004.
23. J. Hobbs, H. Windlass, V. Sundaram, S. Chun, M. Swaminathan, and R. Tummala, "Simultaneous switching noise suppression for high speed systems using embedded decoupling," in Proc. 51st ECTC Conference, Orlando, FL, May 2001.
24. D. Balaraman, P. M. Raj, S. K. Bhattacharya, and R. Tummala, "Novel hydrothermal processing of ceramic-polymer composites for integral capacitor applications," in Proc. Electronic Components and Technology Conference, San Diego, CA, May 2003, pp. 1699-1703.
25. M. F. Davis, A. Sutono, A. Obatoyinbo, S. Chakraborty, K. Lim, S. Pinel, J. Laskar, and R. Tummala, "Integrated RF architectures in fully-organic SOP technology," in Proc. 2001 IEEE EPEP Topical Meeting, Boston, MA, Oct. 2001, pp. 93-96.
26. K. Lim, A. Obatoyinbo, M. F. Davis, J. Laskar, and R. Tummala, "Development of planar antennas in multi-layer package for RF-system on-a-package applications," in Proc. 2001 IEEE EPEP Topical Meeting, Boston, MA, Oct. 2001, pp. 101-104.
27. M. F. Davis, A. Sutono, K. Lim, J. Laskar, V. Sundaram, J. Hobbs, G. E. White, and R. Tummala, "RF-Microwave multi-layer integrated passives using fully organic system on package (SOP) technology," in Proc. IEEE International Microwave Symposium, vol. 3, Phoenix, AZ, May 2001, pp. 1731-1734.
28. M. F. Davis, A. Sutono, K. Lim, J. Laskar, and R. Tummala, "Multilayer fully organic-based system on package (SOP) technology for RF applications," in Proc. 2000 IEEE EPEP Topical Meeting, Scottsdale, AZ, Oct. 2000, pp. 103-106.
29. J. M. Hobbs, S. Dalmia, V. Sundaram, L. Wan, W. Kim, G. White, M. Swaminathan, and R. Tummala, "Development and characterization of embedded thin-film capacitors for mixed signal applications on fully organic system-on-package technology," in Proc. IEEE 2002 Radio and Wireless Conference, RAWCON 2002, Aug. 11-14, 2002, pp. 201-204.
30. R. Ulrich and L. Schaper, "Decoupling with embedded capacitors," CircuiTree, vol. 16, no. 7, pp. 26-26, July 2003.
31. A. Murphy and F. Young, "High frequency performance of multilayer capacitors," IEEE Trans. Microwave Theory Tech., vol. 43, pp. 2007-2015, Sept. 1995.
32. R. Ulrich and L. Schaper, Eds., Integrated Passive Component Technology: IEEE Press/Wiley, 2003.
33. J. Laskar, M. Tentzeris, K. Lim, S. Pinel, M. Davis, A. Rhagavan, M. Maeng, S.-W. Yoon, and R. Tummala, "Advanced system-on-Package RF front-ends for emerging wireless communications," in Proc. 2002 Asian-Pacific Microwave Symposium, Kyoto, Japan, Nov. 2002, pp. III. 1703-1708.
34. R. L. Li, G. DeJean, M. M. Tentzeris, and J. Laskar, "Integration of miniaturized patch antennas with high dielectric constant multilayer packages and soft-and-Hard surfaces (SHS)," in Proc. 2003 IEEE-ECTC Symposium, New Orleans, LA, May 2003, pp. 474-477.
35. R. L. Li, K. Lim, M. Maeng, E. Tsai, G. DeJean, M. Tentzeris, and J. Laskar, "Design of compact stacked-patch antennas on LTCC technology for wireless communication applications," in Proc. 2002 IEEE AP-S Symposium, San Antonio, TX, June 2002, pp. II. 500-503.
36. D. Thompson, P. Kirby, J. Papapolymerou, and M. M. Tentzeris, "W-Band characterization of finite ground coplanar transmission lines on liquid crystal polymer (LCP) substrates," in Proc. 2003 IEEE-ECTC Symposium, New Orleans, LA, May 2003, pp. 1652-1655.
37. D. Balaraman, P. M. Raj, I. Abothu, S. Bhattacharya, S. Dalmia, L. Wan, M. Swaminathan, and R. Tummala, "Integration and high-frequency characterization of PWB-compatible pure barium titanate films synthesized by modified hydrothermal techniques below 100°C," in Proc. 53rd Electronic Components and Technology Conference, New Orleans, LA, May 2003, pp. 1520-1527.
38. Y. Rao, J. Yue, and C. P. Wong, "Materials characterizations of high dielectric constant polymer-ceramic composite for embedded capacitor for RF application," Active Passive Elec. Comp., vol. 25, pp. 123-129, 2002.
39. Z. Huang, C. Cha, S. Chen, J. J. Shen, N. Jokerst, M. Brooke, and A. Brown, "InGaAs MSM photodetector modeling using DOE analysis," Proc. SPIE, vol. 5178, pp. 148-156, 2003.
40. Z. Huang, Y. Ueno, K. Kaneko, N. M. Jokerst, and S. Tanahashi, "Embedded optical interconnections using thin film InGaAs MSM photodetectors," Electron. Lett., vol. 38, pp. 1708-1708, 2002.
41. J. Kim, H. T. Griem, R. Friedman, E. Chan, and S. Ray, "High-performance back-illuminated InGaAs/InAlAs MSM photodetector with a record responsivity of 0.96 A/W," IEEE Photon. Technol. Lett., vol. 4, pp. 1241-1241, 1992.
42. G.-K. Chang, D. Guidotti, F. Liu, Y.-J. Chang, Z. Huang, V. Sundaram, D. Balaraman, S. Hegde, and R. Tummala, Optoelectronic Integration for a Tbps Mixed Signal System Module.
43. T. Suzuki, T. Nonaka, S.-Y. Cho, and N. M. Jokerst, "Embedded optical interconnections on printed wiring boards," in Proc. 53rd ECTC Conference, New Orleans, LA, May 2003, pp. 1153-1153.
44. S.-Y. Cho, J. D. Hall, A. Chellappa, N. M. Jokerst, and M. Brooke, "High speed optical interconnections using embedded PD's on electrical boards," in Proc. 53rd ECTC Conference, New Orleans, LA, May 2003, pp. 1046-1046.
45. S.-Y. Cho and M. A. Brooke, "Optical interconnections on electrical boards using embedded active optoelectronic components," IEEE J. Select. Topics Quantum Electron., vol. 9, pp. 465-465, 2003.
46. S.-Y. Cho and N.-M. Jokerst, "Polymer waveguide optical interconnections for electrical interconnection substrates," in Proc. IEEE Conf. on Lasers and Electro-Optics, vol. 1, 2002, pp. 161-161.
47. D. C. Keezer, D. Minier, and M. C. Caron, "A production-oriented multiplexing system for testing above 2. 5 Gbps," in Proc. IEEE Int. Test Conf. (ITC'03), Charlotte, NC, Oct., pp. 191-200.
48. J. S. Davis, D. C. Keezer, O. Liboiron-Ladouceur, and K. Bergman, "Application and demonstration of a digital test core: Opto-electronic test bed and wafer-level prober," in Proc. IEEE Int. Test Conf. (ITC'03), Charlotte, Oct. 2003, pp. 166-174.
49. D. C. Keezer, J. S. Davis, S. Bezos, D. Minier, and M. C. Caron, "Low-cost strategies for testing Multi-GigaHertz SOP's and components," in Proc. IEEE Electronics Packaging Technology Conf. (EPTC'03), Singapore, Dec. 2003, pp. 410-444.
50. S. Bhattacharya, G. Srinivasan, and A. Chatterjee, "Testing of wireless data transceivers using periodic bitstreams," in Proc. VLSI Test Symposium, 2004.
51. S. Cherubal et al., "Concurrent testing of RF power amplifiers," in Proc. VLSI Design Conference, Jan. 2004, pp. 100-106.
52. R. C. Dunne and S. K. Sitaraman, "An integrated process modeling methodology and module for sequential multilayered substrate fabrication using a coupled cure-thermal-stress analysis approach," IEEE Trans. Electron. Packag. Manufact., vol. 25, pp. 326-334, Dec. 2002.
53. R. C. Dunne, S. K. Sitaraman, S. Luo, C. P. Wong, W. E. Estes, and M. Periyasamy, "Cure kinetics modeling and process optimization of the ViaLux 81 epoxy photo-dielectric dry film (PDDF) material for microvia applications," J. Appl. Polymer Sci., vol. 84, pp. 691-700, 2002.
54. K. Tunga, J. Pyland, R. V. Pucha, and S. K. Sitaraman, "Study on the choice of constitutive and fatigue models in solder joint life prediction," in Proc. ASME International Mechanical Engineering Congress and Exposition, IMECE2002/EPP-39 676.
55. R. V. Pucha, J. Pyland, and S. K. Sitaraman, "Damage metric-based mapping approaches for developing accelerated thermal cycling guidelines for electronic packages," Int. J. Damage Mechanics, vol. 10, no. 3, pp. 214-234, 2001.
56. S. Michaelides and S. K. Sitaraman, "Die cracking and reliable die design for flip-chip assemblies," IEEE Trans. Adv. Packag., vol. 22, pp. 602-613, Nov. 1999.
57. W. Xie, H. Hu, and S. K. Sitaraman, "Role of base substrate material on dielectric and copper interlayer separation," Proc. The IMAPS International Journal of Microcircuits and Electronic Packaging, vol. 25, no. 1, 2002.
58. M. Modi and S. K. Sitaraman, "Interfacial fracture toughness measurement for thin film interfaces," Eng. Fracture Mechan., to be published.
59. S. Hegde, R. V. Pucha, and S. K. Sitaraman, "Alternate dielectric and base substrate materials for enhanced reliability of high density wiring (HDW) substrates," J. Mater. Sci.: Mater. Electron., to be published.
60. R. V. Pucha, G. Ramakrishna, S. Mahalingam, and S. K. Sitaraman, "Modeling plastic strain gradient effects in low-cycle fatigue of copper micro-structures," Int. J. Fatigue, to be published.
61. S. Hegde, R. V. Pucha, D. Guidotti, F. Liu, R. Tummala, and S. K. Sitaraman, "Design, fabrication, and reliability testing of embedded optical interconnects on board," in Proc. 54th Electronic Components and Technology Conference, June 2004.
62. K. Lim, M. F. Davis, M. Maeng, S.-W. Yoon, S. Pinel, L. Wan, D. Guidotti, D. Ravi, J. Laskar, E. Tentzeris, V. Sundaram, G. White, M. Swaminathan, M. Brook, N. Jokerst, and R. Tummala, "Delvelopement of intellinget network communicator for the mixed signal communications using the system-on-a-packaging technology," in Proc. 2003 Asia-Pacific Microwave Conference Digest, 2003, pp. 1003-1006.
63. M. Maeng, K. Lim, Y. Hur, M. Davis, N. Lal, S.-W. Yoon, and J. Laskar, "Novel combiner for hybrid digital/RF fiber-optic application," in Proc. 2002 IEEE Radio and Wireless Conference,