Physical layout automation for system-on-packages

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 41-48

  Ravichandran, Ramprasad ^a   Minz, Jacob ^a   Pathak, Mohit ^a   Easwar, Siddharth ^a   Lim, Sung Kyu ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN ALGORITHMS; INTER-LAYER WIRES; MIXED SIGNALS; SYSTEM-ON-PACKAGE (SOP); THREE-DIMENSIONAL (3D) ROUTING;

ALGORITHMS; AUTOMATION; CAPACITORS; CONSTRAINT THEORY; CROSSTALK; DESIGN; DIGITAL SIGNAL PROCESSING; ELECTRIC INDUCTORS; INTEGRATED CIRCUIT LAYOUT; MICROELECTROMECHANICAL DEVICES; OPTIMIZATION; PRINTED CIRCUIT BOARDS; RESISTORS;

ELECTRONICS PACKAGING;

EID: 10444236433     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)

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