Thermal and crosstalk-aware physical design for 3D system-on-package

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 824-831

  Minz, Jacob ^a   Wong, Eric ^a   Lim, Sung Kyu ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; PROBLEM SOLVING; SIGNAL PROCESSING; TEMPERATURE DISTRIBUTION;

SIGNAL SYSTEM; SYSTEM ON CHIP; THERMAL DISTRIBUTION;

CROSSTALK;

EID: 24644450723     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)

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